Texas Instruments Corporation

Veeco Integrated Automation Inc.

James G Harper

Louis G Bailey

Ganesh Rajagopal

Robert B McJohnson

Don R Walker

In an infrared communications link, a transmitter is connected to a plurality of infrared light emitting diodes disposed about an arcuate surface to illuminate a generally rectangular area with pulsed optical energy. When a receiver having a plurality of photodiodes is disposed within the generally rectangular area the information contained in the pulsed optical energy is recovered. The combination of the transmitter and receiver provide a transceiver that is ideally suited for providing two way communication between a fixed station and an automatically guided vehicle in an electromagnetically hostile environment such as a highly automated factory.

Vehicle to fixed station infrared communications link

In an apparatus for storing articles, bins have a sensor for detecting the presence of an article in a bin and an optical code reader for reading a bar code on the article. The presence detector and the optical code reader are coupled to a circuit which provides an indication of the identity and location of a coded article. The apparatus is particularly well suited for use in the manufacture of semiconductor devices, when wafer cassette boxes are provided with a suitable bar code. Alternatively, the bins may be disposed upon a remotely guided vehicle, thereby making the apparatus useful in an automated manufacturing process.

Apparatus with intelligent bins indicating the presence and identity of

Magnetic bubble chips are packaged along with X, Y and Z magnetic field generating means. The package is comprised of a metal lead frame upon which a magnetic bubble chip such as a memory chip device is mounted. Connectors are utilized to connect terminal pads on the bubble memory device to selected lead frame conductors. The lead frame includes selectively positioned terminal conductors which provide exterior terminals for X and Y magnetic field generating coils. The lead frame is plastic encapsulated with the plastic being formed to completely seal the magnetic bubble chip and connectors while providing mechanical support channels for X and Y magnetic field coils. Openings are provided in the plastic within the channels parallel to the plane of the lead frame on opposite sides thereof exposing the selectively positioned conductors so that the coils are electrically connected to the lead frame terminal conductors. Permanent magnets are provided on either end of the structure and magnetic field spreading plates are provided over the top and bottom of the structure parallel to the plane of the lead frame to generate a constant Z magnetic field.

Magnetic bubble memory packaging arrangement and its method of

A self-encased electronic watch is fabricated by mounting a semiconductor integrated circuit chip on a metal lead frame. Connectors are utilized to connect the circuit to selected lead frame conductors. The semiconductor chip incorporates all of the electronic circuitry necessary to drive a display with decoded timekeeping signals. The lead frame includes selectively positioned conductors for connection of a display, a variable capacitor, oscillator crystal and battery contacts. The lead frame is plastic encapsulated with the plastic being formed to completely seal the integrated circuit and connectors while providing a ridged mechanical support cavity on the front surface for the display annd filter lens and mechanical support cavities on the back surface for the capacitor, crystal and batteries. Openings are provided in the plastic within the cavities and opposite the cavity formations exposing the selectively positioned conductors so that the display, capacitor and crystal may be electrically connected to the lead frame. The openings opposite the capacitor and crystal cavities on the front surface are plugged with design coordinated plastic plugs. The plastic formation includes extensions for attachment of a band and a cover is provided for the back.

Electronic watch and its method of fabrication

An electronic watch module is fabricated by mounting a semiconductor integrated circuit chip on a metal lead frame. Connectors are utilized to connect the circuit to selected lead frame conductors. The semiconductor chip incorporates all of the electronic circuitry necessary to drive a display with decoded timekeeping signals. The lead frame includes selectively positioned conductors for connection of a display, a variable capacitor, oscillator crystal and battery contacts. The lead frame is plastic encapsulated with the plastic being formed to completely seal the integrated circuit and connectors while providing mechanical support cavities for the display, capacitor, crystal and batteries. Openings are also provided in the plastic within the cavities and opposite the cavity formations exposing the selectively positioned conductors so that the display, capacitor and crystal may be electrically connected to the lead frame. Lead frame conductors also extend about the periphery of the module for connection of time setting and/or display demand switches to the battery and circuit.

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Dallas, TX, United States of America

James G Harper