The Perkin-Elmer Corporation

Speedfam-Ipec Corporation

James F Nester

L David Bollinger

Charles B Zarowin

A system for improving the total thickness variation across a surface of a bulk semiconductor wafer includes an initial total thickness variation measuring instrument. The initial total thickness variation profile is then converted to a dwell time versus position map. A confined plasma is then used to selectively locally remove material from the surface so that the final surface of the bulk semiconductor has an improved final total thickness variation.

System for improving the total thickness variation of a wafer

A method for manufacturing X-ray lithography masks containing features smaller than 1 micron in size and having conductive or non-conductive substrates. The method involves the initial deposition, as by evaporation, of a very thin coating of a strong X-ray absorber such as gold. A layer of photoresist is applied to the initial gold layer and exposed and developed to remove the photoresist in the exposed areas. Thereafter, the mask is submerged in an electroless gold plating bath. I have discovered that metals suitable for electroless plating are autocatalytic in nature. Accordingly, additional gold from the bath is preferentially deposited on the exposed first gold layer and is permitted to build to the desired thickness.

Process for manufacturing lithography masks

An apparatus and method for coating a substrate. An electrically conductive substrate is placed in an electrolytic bath with the surface to be coated facing the anode. The cathode is placed near but not touching the other side of the substrate and an electric potential is applied to both electrodes. Means are provided to prevent electroplating of the cathode.

Non-contacting technique for electroplating X-ray lithography

Polymer membranes are formed by spinning a monomer solution on a smooth surface of a plate and heat curing the solution to form a polymer film. A carrier element is attached to the film and together they are immersed in a suitable chemical composition to react with the bond between the film and plate. The assembly is then immersed in water to cause the plate to fall away from the film.

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Ridgefield, CT, United States of America

James F Nester