Lucent Technologies Inc.

James F Dormer

John William Osenbach

Mindaugas Fernand Dautartas

Sailesh Mansinh Merchant

Casimir R Nijander

Michael F Brady

Patrick J Drummond

Daniel Kern

Edward A Pitman

Bruce C Abraham

Patrick J Doran

Marilyn Markey Ecker

A method and apparatus for passively aligning an optical element on an optical die wherein multiple potential mounting pads are supplied for potential mounting of the optical component. Appropriate tables are generated for 1) the response of the optical detecting component for a given light power level as a function of the mounting position of the optical detecting component, and 2) the asymmetry of the light generating component. Given the two tables an algorithm is prepared for automatically determining the appropriate mounting position to provide desired detection device response characteristics for any given light generating component to be mounted on the die.

Method and apparatus for passively aligning components on semiconductor dies

The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.

Bonding of aluminum oxide components to silicon substrates

A method of preparing a supporting substrate of an optical subassembly for metal-oxide bonding an optical element to the substrate. The method includes providing a supporting substrate including a metalized region for metal-oxide bonding an optical element to the substrate and rinsing the substrate in a potassium hydroxide solution. The potassium hydroxide solution removes any excess metal oxide or other contaminants from the surface of the metalized region.

Method for improved metal oxide bonding of optical elements

A lid guide ensures that a lid is accurately positioned and oriented when it is lowered over and placed onto a tray used to hold electronic devices, for example, for transport between different stages in the manufacturing process, thereby helping to prevent damage to the devices that might otherwise result from physical contact with a lid that is placed onto the tray in a haphazard manner. A lid guide may have one or more openings, each of which may be keyed to restrict the tray and the lid to a single rotational orientation. In addition, channels may be provided in opposing walls of each opening in the lid guide to enable a technician to hold either a tray or a lid between a thumb and a finger when placing the tray onto the lid guide or the lid onto the tray.

Lid guide for electronic devices

Disclosed is a method for fabricating devices so that several devices at a time can be tested and sorted. The devices are placed in a carrier so that each device occupies a discrete position. The carrier includes an identification marker, and each device is identified by its position in the carrier. The carrier is sent to multiple assembly and/or testing stations, and data for each device is collected and stored in a central data base according to its position in the carrier. Each device may then be sorted according to the collected data and its position in the carrier.

Fabrication of semiconductor devices

Bonding of aluminum oxide components to silicons substrates

The invention is a method for removing organic and other contaminants, such as photo-resist, from semi-conductor dies and micro-lenses by placing the dies in a solution of two parts ethylene, diamine tetra-acetic-acid (EDTA) to one part peroxide at a temperature of between 30.degree. and 55.degree. C., and preferably between 40.degree. and 44.degree. C., for a period of 1-30 minutes, and preferably between 2 and 10 minutes.

Growing community of inventors

Limekiln, PA, United States of America

James F Dormer