Ams Sensors Singapore Pte. Ltd.

Heptagon Micro Optics Pte. Ltd.

James Eilertsen

Qichuan Yu

Hartmut Rudmann

Simon Gubser

Ji Wang

Kian Siang Ng

Jens Geiger

Javier Miguel Sánchez

Sundar Raman Gnana Sambandam

Markus Rossi

Bernhard Buettgen

Peter Roentgen

Tobias Senn

Florin Cutu

Martin Lukas Balimann

Guo Xiong Wu

Han Nee Ng

Laurent Nevou

Cris Calsena

Sundar Raman Ghana Sambandam

An example system includes a first spectrometer, a second spectrometer, and an electronic control device communicatively coupled to the first spectrometer and the second spectrometer. The first spectrometer is operable to emit first light using a first light source towards a sample region between the first spectrometer and the second spectrometer. The first spectrometer is also operable to measure first reflected light reflected using a first photodetector from an object in the sample region. The second spectrometer is operable to measure first transmitted light transmitted through the object using a second photodetector. The electronic control device is operable to determine, based on at least one of the measured first reflected light or the measured first transmitted light, a spectral distribution of light corresponding to the object.

Measurements using systems having multiple spectrometers

An example system includes a light source, a first spectrometer, a second spectrometer, and an electronic control module. The light source is operable to emit light within a first range of wavelengths in a field of illumination. The first spectrometer is operable to measure first sample light reflected from an object within a second range of wavelengths and in a first field of detection. The second spectrometer is operable to measure second sample light reflected from the object within a third range of wavelengths and in a second field of detection. The electronic control module operable to determine, based on the measured first sample light and the measured second sample light, a distance between the system and the object, and determine, based on the measured first sample light and the measured second sample light, a spectral distribution of light corresponding to the object.

Distance measurements using spectrometer systems

An optoelectronic device has an asymmetric field overlap and is operable to measure proximity independently of object surface reflectivity. In some instances, the optoelectronic device includes a plurality of light-emitting assemblies and a light-sensitive assembly. In some instances, the optoelectronic devices include a plurality of light-sensitive assemblies and a light-emitting assembly. An asymmetric field overlap is attained in various implementations via various field-of-view axis, field-of-view angle, field-of-illumination axis, field-of-illumination angle, optical element and/or pitch configurations.

Proximity sensors and methods for operating the same

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

Thin optoelectronic modules with apertures and their manufacture

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

A thermally tunable optoelectronic module includes a light emitting assembly operable to emit light of a particular wavelength or range of wavelengths. The light emitting assembly is disposed to a temperature-dependent wavelength shift. The thermally tunable optoelectronic module further includes an optical assembly aligned to the light emitting assembly, and separated from the light emitting assembly by an alignment distance. The thermally tunable optoelectronic module further includes a thermally tunable spacer disposed between the optical assembly and the light-emitting assembly, the thermally tunable spacer is operable to counteract the temperature-dependent wavelength shift.

Thermally tunable optoelectronic modules

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

Optical device

Various optoelectronic modules are described that include an emitter operable to produce light (e.g., electromagnetic radiation in the visible or non-visible ranges), an emitter optical assembly aligned with the emitter so as to illuminate an object outside the module with light produced by the emitter, a detector operable to detect light at one or more wavelengths produced by the emitter, and a detector optical assembly aligned with the detector so as to direct light reflected by the object toward the detector. In some implementations, the modules include features for expanding or shifting the linear photocurrent response of the detector.

Optoelectronic module operable for distance measurements

Optoelectronic modules operable to collect distance data and spectral data include demodulation pixels operable to collect spectral data and distance data via a time-of flight approach. The demodulation pixels include regions with varying charge-carrier mobilities. Multi-wavelength electromagnetic radiation incident on the demodulation pixels are separated into different portions wherein the respective portions are used to determine the composition of the incident multi-wavelength electromagnetic radiation. Accordingly, the optoelectronic module is used, for example, to collect colour images and 3D images, and/or ambient light levels and distance data. The demodulation pixels comprise contact nodes that generate potential regions that vary in magnitude with the lateral dimension of the semiconductor substrate. The potential regions conduct the photo-generated charges from the photo-sensitive detection region to a charge-collection region. The photo-generated charges are conducted to the charge-collection region with respective drift velocities that vary in magnitude with the thickness of the semiconductor substrate.

Optoelectronic modules operable to collect spectral data and distance data

The present disclosure describes methods of attaching surfaces together. In one aspect, a method includes depositing a first adhesive onto a first surface of a first item, the first adhesive forming a pattern that at least partially surrounds a region of the first surface where there is no first adhesive. A second adhesive is jetted onto the region of the first surface, wherein the second adhesive has a viscosity lower than a viscosity of the first adhesive. The first surface of the first item and a second surface of a second item are brought into contact with one another. The method also includes curing the first and second adhesives. While the methods can be particularly suitable for manufacturing optical light guide elements, the methods also can be used in other contexts and applications as well.

Methods of attaching surfaces together by adhesives, and devices including surfaces attached together by adhesives

Generating a super-resolved reconstructed image includes acquiring a multitude of monochromatic images of a scene and extracting high-frequency band luma components from the acquired images. A high-resolution luma image is generated using the high-frequency components and motion data for the acquired images. The high-resolution luma image is combined with an up-sampled color image, generated from the acquired images, to generate a super-resolved reconstructed color image of the scene.

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Zurich, Switzerland

James Eilertsen