Qorvo Us, Inc.

James Edwin Culler, Jr

Donald Joseph Leahy

Stephen Craig Parker

Thomas Scott Morris

John August Orlowski

Laminate structures and configurations of fiducials for laminates structures for electronic devices are disclosed. Fiducials are formed in laminate structures to provide increased visibility and contrast, thereby improving detection of the fiducials with optical detection equipment of automated machines commonly used in the electronics industry. Fiducials are disclosed that are defined by openings in laminate structures that extend to depths within the laminate structures to provide sufficient contrast. Openings for fiducials may be arranged to extend through multiple metal layers and dielectric layers of the laminate structures. The fiducials may be formed by laser drilling or other subtractive processing techniques. Fiducials as disclosed herein may be coated with additional layers or coatings, such as a metal coating that includes an electromagnetic shield for electronic devices, and the fiducials are configured with sufficient visibility and contrast to remain detectable through the additional layers or coatings.

Fiducials for laminate structures

The present disclosure provides electromagnetic shielding for integrated circuit modules with a module-bottom sealing procedure. First a precursor package with a number of integrated modules is provided. Each integrated module includes a module substrate having a number of module contacts at a bottom surface of the module substrate. A combination of a shielding protective material and a chemical resistant tape is then applied over the bottom surface of the module substrate, such that each module contact is sealed. Next, the precursor package is singulated at each inter-module area to form a number of individual integrated modules. A shielding structure is applied completely over a side surface of each individual integrated module. Herein, the shielding structure is electrically coupled to a ground plane within the module substrate.

Electromagnetic shielding for integrated circuit modules

The present disclosure provides electromagnetic shielding for integrated circuit (IC) modules. First, a precursor package with a number of IC modules is provided. The precursor package is then placed onto a chemical resistant tape. After a sweller process and a desmear process are performed, the chemical resistant tape is removed. Next, the precursor package is singulated to form a number of individual IC modules. The individual IC modules are placed onto a carrier tape, such that a bottom surface of each individual IC module is covered by the carrier tape, and a top surface and side surfaces of each individual IC module are exposed. A shielding structure is applied completely over the top surface and the side surfaces of each individual IC module. Herein, the shielding structure is electrically coupled to a ground plane within each individual IC module.

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Lexington, NC, United States of America

James Edwin Culler, Jr