General Electric Company

General Electric Corporation Gmbh

Sabic Innovative Plastics IP B.v.

James E Tracy

Michael John Davis

Gary William Yeager

Robert Edgar Colborn

John E Hallgren

Herbert S Chao

Geoffrey Henry Riding

Victoria J Eddy

James R Presley

Jana M Whalen

Edward F Chu

John T Bartholomew

Rakesh Jain

Kalyan Ghosh

A method of forming a poly(arylene ether)-containing solid concentrate is described. The method includes blending a poly(arylene ether), a thermosetting resin, and a compatibilizing agent in the presence of a solvent to form a homogeneous solution, and removing the solvent to yield the solid concentrate. The solid concentrate is useful for preparing curable conditions.

Forming concentrate of poly(arylene ether), thermosetting resin and compatibilizer

A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.

Poly(arylene ether) adhesive compositions

A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an easily dissolved solid concentrate with the thermosetting resin.

Moldable poly(arylene ether) thermosetting compositions, methods, and articles

An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications.

Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.

Curable polyphenylene ether-thermosetting resin composition and process

The present invention is directed to improving the peel strength of copper foil laminated to polyetherimide substrates which optionally are reinforced. The improvement in process comprises coating one side of the copper foil with an adhesive composition, placing the coated side of the copper foil in contact with pre-formed polyetherimide substrate, and heat-pressing the resulting build-up to form a cured laminate of improved peel strength. The adhesive composition utilized comprises a blend of a polyvinyl butyral resin; one or more resole resins, and an organic solvent. Heat-pressing conditions comprise a temperature ranging from about 450.degree. to 550.degree. F. and pressing conditions ranging from about 100 to 700 psi. Within this temperature/pressure range, the adhesive-coated copper foil mated with the pre-formed polyetherimide substrate yields desired peel strengths without inducing excessive flow of the polyetherimide substrate, i.e. maintaining a pre-desired thickness .+-.7.5%.

Copper-clad polyetherimide laminates with high peel strength

Disclosed are curable compositions based on a combination of polyphenylene oxide, monomeric epoxy resin, a compatibilizing metal salt of tin, and suitable curing agents. The monomeric epoxy resin comprises a polyepoxide composition comprising at least one bisphenol polyglycidyl ether having an average of at most one aliphatic hydroxy group per molecule. The composition may be used in the preparation of laminates useful as printed circuit boards.

High performance curable PPO/monomeric epoxy compositions with tin metal

Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.

Curable dielectric polyphenylene ether-polyepoxide compositions

Curable compositions containing a polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and bonding sheets therefor and having excellent physical and electrical properties.

Growing community of inventors

Glenford, OH, United States of America

James E Tracy