Shipley Company LLC

James E Rychwalski

Paul J Ciccolo

Michael P Toben

Mark Lefebvre

Leon Barstad

Edward C Couble

Philip D Knudsen

James L Martin

Stephen S Rodriguez

Robert E Hawkins

Stephane Menard

Robert A Schetty, Iii

Eugene D D'Ottavio

Robert B Currie

Leon R Barstad

Robert A Iii Schetty

The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Electrolytic copper plating method

A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.

Conditioning process for electroless plating of polyetherimides

A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.

Pretreatment process for electroless plating of polyimides

A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby (a) providing the board with a conductive surface and (b) applying a photoresist by electrophoretic deposition.

Electrophoretic method for applying photoresist to three dimensional

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Medway, MA, United States of America

James E Rychwalski