Texas Instruments Corporation

James E Ponder

Graham S Tubbs

Perry Wyan Lou

Stephen A Farnow

An improved CMOS device and method of making it are provided which utilize basically the standard N-channel self-aligned silicon gate structure and process, modified to include a P-channel transistor. A P-type substrate is used as the starting material, with an N-type tank formed for the P-channel transistor. Field oxide is grown after the N-type tank is formed. A polycrystalline silicon layer is deposited and patterned to create gates for both N- and P-channel transistors, then separately masked P- and N-type diffusions or implants form the sources and drains for the two types of transistors.

CMOS Integrated circuit device

An MOS memory cell of the static type employs a pair of cross-coupled driver transistors forming a bistable circuit, with load resistors replaced by a pair of series coupling transistors connecting storage nodes to complementary precharged data lines. The coupling transistors are turned on in sequence, for refresh, so an intermediate node is charged during a first phase and discharged into the storage nodes during the second phase. Both transistors are turned on at the same time for read or write operations.

Semiconductor memory cell with clocked voltage supply from data lines

An improved CMOS device and method of making it are provided which utilize basically the standard N-channel self-aligned silicon gate structure and process (with implants for self-alignment), modified to include P-channel transistors and to allow three levels of interconnects. A P-type substrate is used as the starting material, with an N-type tank formed for the P-channel transistor. The source and drain regions, N+ or P+, are defined prior to the polycrystalline silicon gate; thus the source and drain may run under polysilicon. Self-aligning implants after the polysilicon is defined produce the advantages of self-aligned gates.

Method of making CMOS device allowing three-level interconnects

Method of making CMOS integrated circuit device

An improved MOS device and method of making it are provided which utilize basically the standard N-chanel self-aligned silicon gate structure and process with implants for self-alignment, modified to allow three levels of interconnects. A P-type substrate is used as the starting material, with N+ source and drain regions defined prior to a polycrystalline silicon gate; thus the source and drain may run under polysilicon. Self-aligning implants after the polysilicon is defined produce the advantages of self-aligned gates.

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Cat Spring, TX, United States of America

James E Ponder