Laird Technologies Gmbh

Other

James E Kline

Kenneth M Robinson

Daniel C Green

Michael J Oliver

Profile for a co-extrusion

A grounding strip is described configured to be installed along an edge portion of a substrate for establishing electrical grounding contact between the substrates and a card guide. The grounding strip includes integral grounding members. Each grounding member includes opposing sidewall portions defining a channel configured to receive the edge portion of the substrate therein. The sidewall portions of each grounding member are configured to engage the substrate when the edge portion of the substrate is received in the channel to help retain the edge portion of the substrate in the channel. Each grounding member also includes a contact element disposed generally over the channel. The contact element is integrally formed with at least one of the opposing sidewall portions of the grounding member and is configured to establish electrical contact with the card guide when the grounding strip is installed to the substrate and located in the card guide.

Card guide grounding strips

A gasket generally includes upper and lower members and first and second oppositely-disposed lateral members. The first and second oppositely-disposed lateral members connect the lower member to the upper member such that a spaced distance separates the lower member's inner surface from the upper member's inner surface. The first and second lateral members, lower member, and lower member may collectively define a generally trapezoidal profile.

Gaskets for providing environmental sealing and/or electromagnetic interference (EMI) shielding

A gasket generally includes a base member having an inner surface and an outer surface, and a top member having an inner surface and an outer surface. The gasket also has first and second oppositely-disposed lateral members curving generally inwardly relative to each other and connecting the base member to the top member such that a spaced distance separates the base member's inner surface from the top member's inner surface. The first and second lateral members, base member, and top member collectively define a generally trapezoidal profile with four generally rounded corner portions at about the intersections of the first and second lateral members with the base member and top member.

According to various aspects of the present disclosure, exemplary embodiments are provided of low-profile apparatus capable of providing board level shielding for one or more electrical components while also providing dissipation of heat generated by the one or more electrical components. In one particular embodiment, an apparatus generally includes a resiliently compressible EMI gasket, a heat sink, and a spring clip. The spring clip has resilient legs with feet. The feet are configured to engage the board. When the feet are engaged with the board, a clamping force is generated that compressively biases the heat sink and the resiliently compressive EMI gasket generally towards the board.

Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith

An exemplary apparatus generally includes a fence, a heat sink, and a thermal interface. The fence includes walls defining at least one opening along an upper portion of the fence. The walls are configured to be disposed generally about one or more electrical components of a board. The heat sink includes resilient fingers connected to a lid portion, and configured to engage openings of the fence and/or the board. The lid portion is configured to substantially entirely cover the at least one opening of the fence for cooperatively shielding the one or more electrical components within the interior defined by the lid portion and the fence's walls. The thermal interface is configured such that engagement of the resilient fingers with the openings compresses the thermal interface between the lid portion and the one or more electrical components, thereby forming a thermally-conducting heat path from the one or more electrical components to the heat sink.

Combined board level shielding and thermal management

A construction and method are provided for electronically shielding an electronic component and for removing heat generated by the component. The construction and method involve the use of a shielding can, formed with EMI shielding material that surrounds the electronic component and a lid or cap that both contacts and forms a heat sink with the component and also provides a shielding effect as it acts as the cap for the shielding can.

Snap in heat sink shielding lid

A pipe for consumption of tobacco and other smokable substances, comprises a collapsible, telescopic body in the shape of a truncated cone, closed at its base and open at its narrow end to form a mouthpiece, the sidewall of the body having a first carburetor hole and second stem hole; a stem inserted into the body through the second hole and extending downwardly toward the base of the body and a bowl attached to the exterior end of the stem for the holding of the smokable substance.

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Blairstown, NJ, United States of America

James E Kline