Reliability Incorporated

James E Johnson

Ronald J Darcy

A system and method for burning-in an integrated circuit comprises a socket capable of receiving and supporting the IC, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. A first thermal interface provides releasable thermal contact between the integrated circuit in the socket and a resiliently mounted heat absorbing member. A second thermal interface is provided between the heat absorbing member and the heat sink.

Burn-in board with adaptable heat sink device

A system and method for burning-in an integrated circuit chip including at least a socket capable of receiving and supporting the chip, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. The heat sink includes a thermal interface in releasable thermal contact with the integrated circuit in the socket. The heat sink removes more heat from the integrated circuit than is generated during the burn-in process and the integrated circuit is maintained within a predetermined desired temperature range by monitoring the temperature of the integrated circuit and supplying make-up heat as needed. Multiple sockets can be grouped together and cooled by a manifolded cooling system, with the temperature of each integrated circuit being individually monitored and controlled.

Apparatus capable of high power dissipation during burn-in of a device under test

This invention relates generally to burn-in apparatus and methods for stressing the physical and electrical limits of electronic components under controlled environmental and load conditions and more particularly to a system for temporarily packaging a plurality of semiconductors such that they can be connected to a common electrical input while under controlled environmental conditions including extremes of temperature. The invention has special utility in the handling of integrated circuit devices of the dual-in-line packaging type.

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Houston, TX, United States of America

James E Johnson