International Business Machines Corporation

James E Jasmin

Umberto Garofano

Jeanne P Bickford

Tad Jeffrey Wilder

Ivan L Wemple

Mircea R Stan

Charles S Chiu

A method of integrated circuit design and, more particularly, a method and system to optimize semiconductor products for power, performance, noise, die area, and cost through use of variable power supply voltage compression. The method is implemented in a computer-based tool and includes: embedding relationships in an optimization tool running on a computing device, wherein the relationships are based at least partly on performance, power-supply noise, die area, and power; inputting a set of product data and a set of technology data in the optimization tool running on the computing device; and determining product design parameters including power supply voltage, switching-noise-induced power supply voltage variation, and decap area. The determining is based on the relationships, the product data, and the technology data and is performed using the computing device running the optimization tool.

Method and system to optimize semiconductor products for power, performance, noise, and cost through use of variable power supply voltage compression

A method, system and program product for creating a simplified equivalent model for an IC that can be used for detailed analysis. The equivalent model takes into consideration the effects of all the I/O placement regardless of the non-uniformity of I/O placement. The equivalent model is generated, in part, by partitioning the IC into simulation windows and converting I/Os within each simulation window to a current source having the same current change rate, and then running a simulation on this intermediate model. A current change rate observed for a simulation window is then used to convert back to actual I/Os to create the equivalent model. The equivalent model can be simulated using conventional software, e.g., SPICE, for more detailed analysis such as signal integrity, timing of I/Os and noise.

Integrated circuit and package modeling

A multi-threshold flip-flop circuit having an outside feedback is disclosed. The multi-threshold flip-flop circuit comprises a master latch and a slave latch. Coupled between an output of the slave latch and an input of the master latch, a switchable feedback path is utilized to retain logical values of the slave latch during a sleep mode of the flip-flop circuit.

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Jeffersonville, VT, United States of America

James E Jasmin