Chroma Ate Inc.

Other

Telco Testing Systems LLC

Motorola Corporation

Chruma Ate Inc.

James E Hopkins

Michael Peter Costello

Herbert Tsai

Ching-Too Chen

Roger Brueckner

Christopher J LeBeau

Rudolph J Sterbenz

William H Newbauer

Rudy Sterbenz

A fixture assembly for testing a surface emitting laser diode and a testing apparatus having the same are provided. The fixture assembly comprises a base, an upper cover and a latch mechanism. The base includes at least one pocket, and at least one electrical contact interface disposed in the pocket. The upper cover includes a body, an abutting block and a pressing member disposed in the body. The abutting block is engageable with the body for slidable movement with respect to the body. The latch mechanism is disposed on the base and the upper cover, and is configured to selectively connect or disconnect the base to or from the upper cover. When the latch mechanism is operated to connect the base to the upper cover, the pocket and an opening of the abutting block form into a through cavity through which the laser diode emits the laser beam.

Fixture assembly for testing surface emitting laser diodes and testing apparatus having the same

A fixture assembly having a base, an upper cover and a latch mechanism for testing an edge-emitting laser diode and a testing apparatus having the same are provided. The base includes a pocket, and a transmission cavity in communication with and orthogonal to the pocket. The upper cover includes a body, an abutting block and a pressing member. The abutting block having an electrical contact interface is engageable with the body for slidable movement with respect to the body. The latch mechanism is disposed on the upper cover, and may selectively connect or disconnect the upper cover to or from the base. When the latch mechanism is operated to connect the upper cover to the base, the pressing member applies a force through the abutting block on the edge-emitting laser diode received in the pocket, and the edge-emitting laser diode emits the laser for inspection through the transmission cavity.

Fixture assembly for testing edge-emitting laser diodes and testing apparatus having the same

A measurement fixture for a battery cell is provided when the battery cell is connected to an apparatus. The measurement fixture comprises a chamber, a pressure sensor and an expansion sensor. The chamber defines a sealed space for receiving the battery cell. The pressure sensor is mounted to the chamber to sense a change of pressure in the sealed space due to a volume change of the battery cell to calculate pressure in the battery cell and the volume change of the battery cell non-contactly. The expansion sensor is mounted to the chamber to sense a deformation of the battery cell to calculate a correlation between the pressure in the battery cell and the volume change of the battery cell non-contactly.

Measurement fixture for a battery cell

A Christmas tree fire prevention device preferably includes an air-pressurized reservoir containing fire-retardant agent and a mechanism for automatically discharging the fire-retardant agent. The discharging mechanism may be connected to the reservoir via a flexible hose may also be removably attached to the apex of an existing Christmas tree and camouflaged as a holiday decoration. A mechanism for automatically emitting an alarm signal when the automatic fire-retardant agent discharging mechanism is activated may further be included. The discharging mechanism may include a valve with a metal-alloy plug which has a relatively low melting point. Flame heated air preferably causes the plug to melt and activates the discharging mechanism, which ejects the plug from the valve. The pressurized fire-retardant may then egress through the valve, deflect off a guard located on top of the discharging mechanism, and cover the Christmas tree.

Automatic fire extinguishing system for an existing Christmas tree and associated method

A method for testing System-In-Package (SIP) devices each having a plurality of electrical contacts is described. The method and apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time.

Method for testing system-in-package devices

Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a SIP device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray. The apparatus also includes a sorter automatically operable to remove each SIP device that did not pass electrical testing with SIP devices that did pass electrical testing until a tray of electrically tested SIP devices is fully populated with SIP devices that did pass electrical testing.

Apparatus for testing system-in-package devices

Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical contacts is described. The apparatus comprises a JEDEC standard tray receiving apparatus comprising a plurality of tray aligners to align the tray into a predetermined position to account for dimensional tolerances of the tray. The apparatus further comprises a test assembly proximate the tray receiving apparatus. The assembly comprises; a plurality of test circuits corresponding in number to the number of cells in the tray, a plurality of groups of test contacts, each of group of the test contacts being coupled to one of the test circuits and being oriented to engage a plurality of electrical contacts of a SIP device disposed in a corresponding one of the cell, the plurality of test circuits being operable to simultaneously, electrically test a predetermined number of SIP devices in a JEDEC standard tray engaged by the receiving apparatus without removing the SIP devices from the tray.

Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a micro SD device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the micro SD devices in each tray engaged by the hive without removing the micro SD devices that did pass electrical testing until a tray of electrically tested micro SD devices is fully populated with micro SD devices that did pass electrical testing.

Test circuits of an apparatus for testing micro SD devices

Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus of the illustrative embodiment comprises a test hive comprising: a plurality of test circuits corresponding in number to the number of cells in the tray; and a plurality of groups of test contacts, each of the groups of the test contacts being coupled to one of the test circuits and being oriented to engage the plurality of electrical contacts of SIP device disposed in a corresponding one of the cells, the test hive being operable to simultaneously, electrically test all of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray.

Test circuits of an apparatus for testing system-in-package devices

A method and apparatus for testing micro SD devices each having a plurality of electrical leads is described. The method and apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

Method for testing micro SD devices using test circuits

A method for testing System-In-Package (SIP) devices such as micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

Method for testing plurality of system-in-package devices using plurality of test circuits

A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time. The method of the illustrative embodiment include the steps of: providing a test hive comprising a plurality of test circuits corresponding in number to at least a predetermined portion of said cells and comprising a plurality of groups of test contacts, each group of said groups of test contacts being coupled to one of said test circuits and being oriented to engage said plurality of electrical contacts of a micro SD device disposed in a corresponding one of said cells; moving each said tray from said stack one at a time to a position proximate said test hive; causing relative movement of said tray proximate said test hive whereby said test hive engages said tray of micro SD device and said test hive such that electrical connection is made simultaneously by each of said groups of test contacts with said electrical contacts of a micro SD device disposed in said corresponding of said cells; and simultaneously, electrically testing at least a predetermined portion of said micro SD devices in each tray engaged by said hive without removing said micro SD devices from said tray.

Method for testing micro SD devices using each test circuits

A testing apparatus is described with a housing, a power source, a carrier assembly, and a backbone connecting the carrier assembly to the power source. A resource board is disposed on the carrier assembly and is connected thereto, thereby receiving power from the power source through the carrier assembly. The resource board is adapted to perform a test on a device under test and to generate data reflecting results of the test on the device under test. A test pin assembly is disposed at one end of the resource board and is connectable with a loadboard. A controller operatively connects to the power supply, the carrier assembly, and the resource board. The controller is adapted to communicate with the resource board to execute instructions to test the device under test. The controller also receives the result data from the resource board, permitting analysis of the device under test.

Method for testing electronic components

Apparatus, method and system for testing electronic components

An apparatus for and method of determining the coplanarity of leads of a semiconductor device is provided. The apparatus comprises a base (24) for placing the semiconductor device, and a plurality of mirrors (38) and (36) surrounding the base. The mirrors reflect an image of the leads of the semiconductor device to a camera. The camera records an image from which the lead coplanarity is determined. The base contains an optical datum (34) which provides a reference plane from which to measure coplanarity. The mirrors can be placed such that an off-axis image of the leads is reflected to the camera. The off-axis image improves the apparent sensitivity of the coplanarity measurement.

Growing community of inventors

Mesa, AZ, United States of America

James E Hopkins