Indium Corporation

Other

James E Hisert

Ross B Berntson

Robert N Jarrett

Jordan P Ross

Benjamin Lee Sitler

Frank Giotto

David P Socha

Raymond Joseph Wertz

Elizabeth Claire Hotvedt

Murray Joseph Selwyn Kirshtein

Elizabeth Clarie Hotvedt

Implementations of the disclosure are directed to thermally decomposable build plates that enable the facile release of 3D metal printed parts created by additive manufacturing. In some implementations, an additive manufacturing build plate comprises: a top surface, a bottom surface, and sidewalls comprised of a material, wherein the top surface, bottom surface, and sidewalls are dimensioned such that the build plate is useable in a 3D printing device; and a recessed section formed through the top surface, wherein the recessed section is configured to be filled with a solid metal or metal alloy to provide a surface for forming a 3D printed object in the 3D printing device.

Thermally decomposing build plate for facile release of 3D printed objects

A method of joining a semiconductor die to a passive heat exchanger can include applying a bond enhancing agent to a semiconductor device; creating an assembly that includes a thermal interface disposed on the semiconductor device such that a first major surface of the thermal interface material is in touching relation with the bond enhancing agent on the semiconductor device, and a heat exchanger disposed in touching relation with a second major surface of the thermal interface material; and reflowing the assembly such that the thermal interface bonds the heat exchanger to the semiconductor device. Embodiments can use the ability of indium to bond to a non-metallic surface to form the thermal interface, which may be enhanced by a secondary coating on either or both joining surfaces.

Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger

A semiconductor device assembly includes: a semiconductor device; a heat exchanger; and a thermal interface material. In embodiments, the thermal interface material may contact a facing surface of the heat exchanger, the thermal interface material includes alloys that react with a bond enhancing agent to form an indium alloy layer in a portion of the thermal interface. In embodiments, a solid, solder preformed thermal interface material includes an indium metal and may be disposed on the first surface of the semiconductor device; and a liquid metal bond enhancing agent may be disposed on a first surface of the semiconductor device; and contacting a facing surface of the heat exchanger.

Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger

Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger

There is provided an apparatus that determines the location of an impermissible tamper on an object, such as an impermissible attempt to gain access to a manhole system or an attempt to steal a work of art, includes a housing disposed adjacently to the object. A fiber optic cable runs through the housing. The object includes a portion that cooperates with internal components of the housing to maintain the fiber optic cable in a non-attenuated state. Upon the impermissible tamper, that portion of the object no longer cooperates with the internal components of the housing. An elastic force internal to the housing cooperates with more internal housing components to create a microbend to the fiber optic cable. Using known optical time domain reflectometer technology, the location of the microbend along the fiber optic cable is readily discerned.

Fiber optic cable sensor for movable objects

Growing community of inventors

Utica, NY, United States of America

James E Hisert