Cardiac Pacemakers, Inc.

Boston Scientific Scimed, Inc.

James E Blood

Keith R Maile

Moira B Sweeney

David A Chizek

John E Hansen

Steven J Meyer

Daniel J Foster

Jean M Bobgan

William J Linder

Ron A Balczewski

Nick A Youker

Michael J Lyden

Troy A Giese

Robert Allen Jones

Patrick J Barry

Matthew Hein

Randy White

Doug E Giwoyna

Robert M Mohn

Michael John Kane

Benjamin J Haasl

Brian L Schmidt

Gregory J Sherwood

Brian D Soltis

Andrew L De Kock

John M Edgell

Eric A Mokelke

Jacob M Ludwig

Scott A Spadgenske

Bart A Carey

Jack Gordon

Mathew L Gilk

Lonnie D Myers

Shawn Larson

Matthew A Hein

A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Electrical arrangements for sensor assemblies in electromagnetic navigation systems

This document discusses, among other things, systems and methods to fabricate and operate an implantable medical device. The implantable medical device can include a housing portion defining an interior chamber. The implantable medical device can include a circuit in the interior chamber. The implantable medical device can include a first electronic component that is not in the interior chamber. The implantable medical device can include a substrate coupled to the housing, the substrate including a first via extending through the substrate, the first via electrically coupling the first electronic component to the circuit.

Chip or silicon based feedthrough

Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.

Implantable medical devices with flexible interconnect having strain relief

This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.

Buzzer apparatus

A sensor assembly includes a substrate including a first portion, a second portion, and a rolled section positioned between the first portion and the second portion. The sensor assembly further includes a first magnetic field sensor coupled to the first portion. The first magnetic field sensor has a primary sensing direction aligned with a longitudinal axis of the sensor assembly. The sensor assembly further includes a second magnetic field sensor coupled to the second portion. The rolled section is shaped such that the second magnetic field sensor is oriented with respect to the first magnetic field sensor so that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

Sensor assemblies for electromagnetic navigation systems

Devices and circuits for reducing sizes of medical devices are disclosed. In one example, an implantable medical device (IMD) may include a housing, multiple electrodes outside of the housing, an energy storage device within the housing, and a circuit within the housing and connected to the energy storage device and the two or more electrodes. In some cases, the circuit may include two or more island sections, with each island section connected to at least one other island section by a ribbon section. Each island section may have two opposing major surfaces. A first island section and a second island section may be stacked within the housing such that one of the two major surfaces of the first island section faces one of the two opposing major surfaces of the second island section.

Implantable medical device with stacked circuit components

A filtered feedthrough assembly for an implantable medical device comprises a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

Filtered feedthrough assembly for implantable medical electronic devices

A system for mapping and marking baroreceptors of a patient. The system includes a mapping device, a marker, and a stimulator. The mapping device includes a plurality of electrodes to be situated on the patient. The marker is to be attached to the patient and mark a location of at least one of the plurality of electrodes based on an analysis of patient physiological responses to stimulation of the plurality of electrodes. The stimulator is to divide the plurality of electrodes into a first electrode zone and a second electrode zone and stimulate electrodes in the first electrode zone and the second electrode zone to obtain first patient physiological responses, where one of the first electrode zone and the second electrode zone is selected based on the first patient physiological responses.

Baroreceptor mapping system

Implantable medical devices comprising electromagnetic interference shields which incorporate a dump resistor and various enhancements to control high voltage arcing. Included are embodiments in which a dump resistor is provided in a flexible shield having first and second conductive layers, where the resistor is provided in a layer between the conductive layers. In additional examples the design of plated through-holes is done to avoid the potential for arcing while maintaining close spacing.

Implantable medical devices having flexible electromagnetic interference and dump resistor shields

A filtered feedthrough assembly for an implantable medical device includes a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and a plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

One embodiment of the present subject matter includes an implantable medical device which includes a first power source comprising a first plurality of substantially planar electrodes, the first power source including at least a first power source face, an electronics module including a first substantially planar electronics face, and a second electronics face opposed to the first substantially planar electronics face, with the first substantially planar electronics face adjacent to, and substantially coextensive with, the first power source face and a second power source comprising a second plurality of substantially planar electrodes, the second power source positioned adjacent to and adapted to interface with the second electronics face.

Implantable pulse generator with a stacked capacitor, battery, and electronics

A method of preparing an integrated circuit module for attachment to a PC substrate. At least one uncased semiconductor die is affixed to a TAB tape frame having concentrically arranged an outer conductive test pad footprint, and an intermediate bond pad footprint. Conductive traces connect the bond pads individually to test pads and to ball grid array pads on the TAB tape within the confines of the bond pad footprint. Wire bonds connect input/output points of the die to the bond pads The die and the wire bonding are next overmolded with a plastic forming a cased integrated circuit module. Testing and burn-in of the module is achieved by connecting test probes to the test pads After the test and bum-in step, the integrated circuit module is cut free from the TAB tape frame for attachment to a PC board, via the ball grid array.

Method for preparing integrated circuit modules for attachment to printed circuit substrates

The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, a method includes forming at least a portion of an internal ground layer along at least a portion of a chip carrier edge, applying an electrically conductive layer to at least a portion of the chip carrier edge, the conductive layer being applied over the exposed portion of the ground layer and in electrical contact with said ground layer, and forming at least one cavity within the top surface of the chip carrier, where the at least one cavity configured to hold one or more integrated circuit chips therein.

Growing community of inventors

Shoreview, MN, United States of America

James E Blood