Pulse Electronics Gmbh

Pulse Engineering, Inc.

Varian Associates, Inc.

James Douglas Lint

Fuxue Jin

Victor Aldaco

Aurelio J Gutierrez

Francisco Michel

Russell L Machado

Victor H Renteria

Ka K Wai

Bryan P Kent

Willy Marzec

Nanci Vogtli

Moin Ahmad

A low profile, small size and high performance electronic device for use in, e.g., electronic circuits which provides maximum creepage and/or clearance distances. In one embodiment, the device is configured for a small footprint and utilizes two or more windings that require isolation. The exemplary device includes a self-leaded header made from a unitary construction which comprises a generally a box-like support body having a cavity for mounting a circuit element with primary and secondary windings, the support body having a base and a plurality of leads extending generally horizontally outward from the support body adjacent the base, the support body having one side opening on a side with leads permitting the loading of the inductive device in the cavity, and a routing channel residing on the top of the base, so as to maximize the creepage and clearance distance of the electronic device. Shaped-core and other embodiments are also disclosed.

Advanced electronic header apparatus and methods

A low-cost and high-precision current sensing device and methods for use and manufacturing. In one embodiment, the current sensing apparatus comprises a Rogowski-type coil which is manufactured in segments so as to facilitate the manufacturing process. In an exemplary embodiment, the current sensing apparatus segments are asymmetric in shape and/or composition (e.g., bobbin shape, size, and/or winding configuration) so as to account for asymmetries in the magnetic field distribution around a bus bar, or to accommodate its shape in a more compact form factor, and/or to improve the immunity to the effects of an external magnetic field. Methods of manufacturing and using the aforementioned current sensing apparatus are also disclosed.

Current sensing devices with integrated bus bars

A low-cost and high-precision current sensing device and methods for use and manufacturing. In one embodiment, the current sensing apparatus comprises a Rogowski-type coil which is manufactured in segments so as to facilitate the manufacturing process. In an exemplary embodiment, the current sensing apparatus segments comprise a number of bobbin elements that are wound and subsequently formed into complex geometric shapes such as torus-like shapes. In an alternative embodiment, bonded windings are utilized which allow the segments to be formed without a bobbin or former. In yet another alternative embodiment, the aforementioned current sensing devices are stacked in groups of two or more. Methods of manufacturing and using the aforementioned current sensing apparatus are also disclosed.

Current sensing inductive devices

Current sensing devices and methods

A low profile and small size electronic device for use in, e.g., electronic circuits which provides maximum creepage and/or clearance distances. In one embodiment, the device is configured for a small footprint and utilizes two or more windings that require isolation. The exemplary device includes a self-leaded header made from a unitary construction which comprises a box-like support body having a cavity for mounting a circuit element, the support body having a base and leads extending generally horizontally outward from the support body adjacent the base, the support body having one side opening on a side with leads permitting the loading of the inductive device in the cavity, and a routing channel residing on the top of the base, so as to maximize the creepage and clearance distance of the electronic device. Shaped-core and other embodiments are also disclosed.

A device for electrically interconnecting the wire leads of various electronic elements within a microminiature package. A non-conducting base member having a plurality of electronic element barriers and wire lead through-holes is provided. The through-holes are generally located within the interior regions of the base element to minimize potentially detrimental field interactions or capacitive coupling between the leads and the external package terminals. During package assembly, the electronic elements are placed within recesses created within the base member by the aforementioned barriers. These recesses and barriers align the elements and help maintain electrical separation and uniformity during manufacturing. The wire leads from two or more elements are interconnected by twisting them together and inserting them into one of the through-holes. The leads are inserted into the through-holes such that they protrude below the bottom surface of the base element, thereby facilitating soldering of all such connections in a single process step. This arrangement reduces manufacturing and labor costs and increases component and overall package reliability.

Through-hole interconnect device with isolated wire-leads and component

A microelectronic component carrier package and method of its manufacture. A non-conducting component carrier having vertical risers and guide channels permits the rapid and accurate routing of microelectronic component leads with respect to the leadframe. Specially shaped perforations in the leadframe adjacent to and aligned with the guide channels receive the leads, strip away the necessary amount of insulation, and sever the leads to the proper length in one manufacturing process step. The leads are joined to the leadframe by an interference fit, conventional bonding technique (such as solder or thermal compression bonding), or other techniques. The perforations further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe and leads to reside outside of the package, thereby minimizing the overall volume of the package. The perforations may also be used as masks for laser energy used to strip insulation from the leads in the vicinity of the perforations.

Microelectronic component carrier and method of its manufacture

An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.

Wire-lead through hole interconnect device

A self leaded holder for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, lead ports extending from the cavity through the sides, an inductance coil mounted in the cavity, and a lead extending from the coil via the lead ports to and wound a partial turn around each of the lead support members and disposed for surface bonding to a PC board.

Self leaded surface mount coil lead form

A compliant lead structure for mounting a circuit element to a PC board comprises a support body for supporting a circuit element, a plurality of elongated compliant cylindrical conductive lead members secured at an inner end to the support body and extending outward from the support body substantially perpendicular to a mounting plane of a PC board to which the support body is to be mounted and to a position for surface bonding to a PC board, the lead members having an elongated unrestricted section between the inner end and the outer end for enabling relative movement between the support body and a PC board to which the lead member is bonded, and a lead wire extends from a circuit element on the support body and connected to the lead member.

Compliant cantilever surface mount lead

An electronic device having a plurality of leads comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity therein and a plurality of lead slots extending from the cavity to a base of the holder, an electronic element mounted in the cavity and having a plurality of leads extending therefrom, a plurality of the leads extending within the slots from the element to the base, and a plurality of lead terminals mounted on the holder and each having one end extending into one of the slots into conducting engagement with a lead and a free end extending outward therefrom.

Electronic microminiature packaging and method

An apparatus for automatically processing the wire ends of cores includes a forming die for bending the axially projecting wire ends back to project parallel to one another generally away from the core. Cores are received in a receiving station aligned with the forming die and orientated so that the wire ends are spaced as far as possible from the die. When the wire ends are sensed to be in the correct orientation, an actuator is operated to push the core through the forming die. The core with its wire ends bent back is then preferably stepped through a series of processing stations to trim and tin the wire ends and then ejected from the machine. A series of cores can be stepped continuously one after the other through the machine.

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Cardiff, CA, United States of America

James Douglas Lint