Siemens Energy, Inc.

Siemens Power Generation, Inc.

James David Blackhall Smith

Gary C Stevens

John William Wood

Gary Stephens

In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrixa high thermal conductivity filler. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types.

High thermal conductivity materials aligned within resins

In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystalpolymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids

Structured resin systems with high thermal conductivity fillers

The present invention provides a continuous high thermal conductivity organic-inorganic composite material. The composite material features high thermal conductivity materials bonded to a host resin matrix by covalent linkages. The bonding takes place through surface functional groups that are reactively grafted to the high thermal conductivity material. These surface functional groups react with the host resin matrix, forming the covalent linkages. The structure of the composite material is effective to reduce phonon scattering and increase phonon transport in the composite material.

High thermal conductivity materials with grafted surface functional groups

The present invention is a continuous high thermal conductivity resin featuring high thermal conductivity (HTC) materialsand a host resin matrix. The HTC materialsform a continuous organic-inorganic composite with the host resin matrixvia surface functional groups that are grafted to the HTC materialsand form covalent linkages with the host resin matrix. Phononstend to pass along the HTC materialsas they travel through the host resin matrix, and phononspass to the next HTC material if the distance between these materials is less than n.

In one embodiment the present invention provides for a diamond like coating on small particles. This comprises small particlesin the size range of approximately 1-1000 nm and a diamond like coating on the small particles. The diamond like coating is distributed over approximately 50-100% of the surface of the small particles and the diamond like coating is one micron or less in thickness. These small particles then may be applied to materials such as resinsand insulating tapes.

Growing community of inventors

Monroeville, PA, United States of America

James David Blackhall Smith