Texchem Advanced Products Incorporated Sdn. Bhd.

Peak Plastic and Metal Products (international) Limited

Peak Plastic & Metal Products (int'l) Ltd.

Daewon Semiconductor Packaging Industrial Company

James D Pylant

Alan L Waber

Scott C Bradley

Christopher R Mack

Amos E Avery

David A Miller

Galen J Hoffman

Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.

Single and dual stage wafer cushion

Single and dual stage wafer cushion and wafer separator

Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The latching mechanism is located in a protective latch well that minimizes accidental opening of the latch(s). The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation.

Wafer container with recessed latch

Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.

Wafer container with adjustable inside diameter

Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.

Wafer container

Wafer container with overlapping wall structure

A wafer container comprising a base and a cover that nest together. The base includes a staggered wall structure composed of inner and outer walls. The staggered wall structure is arranged so that forces from side impacts are absorbed principally by outer wall segments. A rib on the cover restrains the outer wall segments from flexing beyond the inner wall diameter. Reference tabs on the base facilitate alignment of the base to the cover.

Wafer container with staggered wall structure

A cantilevered clip is provided for holding a stack of at least one tray and tray cover. Stack compressive forces applied by the clip are substantially limited to tray and cover edge portions. The clip has a channel base with left and right side walls attached for restricting movement of a stack in left and right directions. Pressure members are positioned orthogonal to at least one wall. An aperture is located adjacent to each pressure member and partially extends into each wall. Protrusions above the base extend inward towards the walls of the channel for captivating the stack in an upward direction.

Cantilevered tray clip with aperture

A clip is provided for holding a stack of at least one tray and tray cover. Stack compressive forces applied by the clip are substantially limited to tray and cover perimeter rail portions. The clip has a channel base with left and right side retaining walls attached for restricting movement of a stack in left and right directions. Left and right rods protrusions above the base extend inward towards the walls of the channel from the left and right side walls respectively for captivating the stack in an upward direction. Spring protrusions extend upward from the base on input and output ends of the channel, and are configured for applying an upward spring force on opposing bottom edge areas of the stack.

Bare die tray clip

An injection molded container for storing and transporting wafers includes a base having a wafer area upon which to place a stack of a plurality of wafer assemblies, wherein each wafer assembly includes a wafer frame upon which is mounted a wafer. A protective wall apparatus is positioned around the wafer area, and includes at least one wall contour artifact. Each wafer frame according to the invention includes a corresponding opposite/mating artifact. The wall apparatus and wafer frame are configured so that the wafer frame must be oriented to mate the wall and frame artifacts in order for the wafer frame to be installed in the container.

Wafer shipper with orientation control

An injection molded container for storing and transporting wafers includes a base having a wafer area upon which to place a stack of a plurality of wafers. A protective wall surrounds the wafer area, and extends upward, having a first perimeter at the base and a second perimeter at a top wall extremity that is greater than the first perimeter, resulting in the wall being positioned with a draft angle to a line perpendicular to a plane of the base so as to facilitate removal of the container from an injection mold. This invention provides a plurality of wafer positioning columns, each having a surface with a line of contact rising perpendicular to the plane of the base. The lines of contact are positioned so as to restrict movement of a stack of wafers placed in the container.

Wafer storage container with wafer positioning posts

A clip is provided for holding a stack of trays and a tray cover. The clip has a base having a width providing clearance for a width of a tray and a cut-away relief area for finger access. First and second opposing resilient side walls and a resilient back wall extend upward from the base, forming a structure with an open front and top. First and second resilient, elongated and downwardly curved members are included, each having a proximal end attached to an upper front of a corresponding side wall, and a distal end attached to the back wall. The resilient members are positioned so as to apply pressure to first and second opposing perimeter portions of a tray placed in the clip.

Growing community of inventors

Temecula, CA, United States of America

James D Pylant