Cool Options, Inc.

Other

Cool Shield, Inc.

Cool Polymers, Inc.

Chip Coolers, Inc.

Cool Options, Inc. a New Hampshire Corp.

Cool Options, Inc. a Corporation of the State of New Hampshire

Cool Optins, Inc.

James D Miller

Kevin A McCullough

E Mikhail Sagal

Lyle James Smith

Mikhail Sagal

Ronald L Lawrence

Ralph E Brice

Ronald G Green

Kevin A Mccullough

A method of metal injection molding on a plastics injection molding machine having a heated barrel with an increasing temperature gradient is disclosed. The method comprises the steps of providing a metal alloy feedstock including a first metal alloy with a first melting point and a second metal alloy with a second melting point that is higher than the first melting point, the first metal alloy and the second metal alloy providing a gradient in composition of solids to liquids paralleling the temperature gradient of the heated barrel, feeding the first metal alloy and the second metal alloy into the plastics injection molding machine, heating the first metal alloy and the second metal alloy within the plastics injection molding machine to about 500-700&#xb0; F./260-372&#xb0; C.; and forming an equilibrium of about 5% to about 30% solids to liquids between the first metal alloy and second metal alloy within the heated barrel.

Multi-component composition metal injection molding

An injection moldable, thermally conductive polymer composition that has ultra low CTE properties is provided. The composition is suitable both for substrate applications in high precision electronics assemblies as well as over molding applications in conjunction with ceramic substrates. The composition includes a base polymer matrix material loaded with thermally conductive filler, which imparts thermal conductivity to the polymer matrix while also maintaining or enhancing the dielectric properties of the base polymer. The resultant composition exhibits CTE properties in the range of between 9 ppm/&#xb0; C. and 2 ppm/&#xb0; C., exhibits an optical anisotropy of below 1.5, and a thermal conductivity of greater than 2 W/m&#xb0; K. The composition is suitable for use in over molding applications in conjunction with virtually any suitable electronics substrate material without the introduction of mechanical stresses produced by large CTE differentials.

Thermally conductive polymer compositions having low thermal expansion characteristics

A method of metal injection molding on an injection molding machine having a heated barrel with an increasing temperature gradient is disclosed. A first step includes providing a metal alloy feedstock including a first component having a first melting point and a second component having a second melting point that is higher than the first melting point, the first melting point and the second melting point selected to match the temperature gradient of the heated barrel of the injection molding machine. A second step includes feeding the metal alloy feedstock into the injection molding machine. A third step includes melting the metal alloy feedstock within the heated barrel of the injection molding machine. A fourth step includes maintaining the percentage of solids to liquids in the metal alloy feedstock of the first component and second component within a processable range of about 5% to about 30%.

A metal alloy feedstock and method for metal injection molding is disclosed. The alloy includes at least two components, such as a first component and a second component. The first component has a first melting point and the second component has a second melting point higher than the first melting point. The first melting point and the second melting point match to the temperature gradient of the heated barrel of an injection molding machine whereby when fed into the injection molding machine the first component melts prior to the second component melts and enables the second component to solute into the first component. Additional components may also be used.

A thermally conductive polymer composition having enhanced mechanical properties is provided. The polymer composition consists of a base polymer matrix loaded with fillers that results in a thermal conductivity that is greater than 1.5 W/m&#xb0; K and a tensile modulus within an acceptable range making the composition suitable for structural plastic applications, such as between 1,700 to 12,000 Mpa and more preferably between approximately 2,700 to 10,000 Mpa and even more preferably in the range of between approximately 4,000 to 9,000 Mpa. In addition to a tensile modulus within the identified range the composition also includes an elongation to break value that is at least above 1.0% and more preferably in the range of about 1.2% to 10%.

Thermally conductive polymer compositions having moderate tensile and flexural properties

A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.

Polymer electronic device package having high thermal conductivity and dielectric strength

The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Thermally conductive elastomeric pad

The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Thermally conductive elastomeric pad and method of manufacturing same

The present invention relates to a self-heating container for heating consumable items such as food and beverages. The container assembly includes a star-shaped inner container for holding heating media that produces an exothermic reaction, and an outer container for holding a consumable item such as food and beverages. The inner container includes a thermally conductive polymer composition, and the outer container includes a heat-insulating material. The thermally conductive polymer composition includes a base polymer matrix and filler material.

Self-heating food and beverage container made from a thermally conductive polymer composition

An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.

Molded electronic connector formed from a thermally conductive polymer composition and method of making the same

The electronic connector () includes an improved heat dissipating housing for cooling heat generating devices located within the connector (). The electronic connector () of the present invention enables the cost-effective cooling of electronic devices () within the connector () while realizing superior thermal conductivity and improved electromagnetic shielding. A method of forming an electronic connector () that includes the steps of first providing a heat generating electronic component () capable of electronically coupling two data devices together having a first port () and a second port (). This component () is typically mounted or installed into a circuit board (). An outer housing () of moldable thermally conductive polymer material () is overmolded around the heat generating electronic component () leaving the first port () and the second port () of connector () exposed.

Highly thermally conductive electronic connector

A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m&deg; K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Method of forming a highly thermally conductive and high strength article

A thermally conductive lamp reflector is provided that dissipates heat from a light source within the reflector. The reflector assembly includes a shell having a metallized layer on its surface. The shell is made from a composition including about 30% to about 80% by volume of a base polymer matrix and about 20% to about 70% by volume of a thermally conductive filler material. The reflector has a thermal conductivity of greater than 3 W/m&deg; K and preferably greater than 22 W/m&deg; K. The reflectors can be used in automotive headlamps, flashlights, and other lighting fixtures. A method of forming the lamp reflector is also provided.

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Marietta, GA, United States of America

James D Miller