Ericsson Gmbh

Telefonaktiebolaget Lm Ericsson (publ)

Other

Erisson Inc.

James D MacDonald, Jr

Walter M Marcinkiewicz

Yawei Ma

Gerard James Hayes

John Michael Spall

Nils Rutger Rydbeck

Russell Evans Winstead

Rahul Gupta

Peter Dimitrios Karabinis

Seung Kil Kim

Patrick Edward Nixon

Bart Peter Reier

James H Jones, Jr

Eric Richard Burgan

Michael Slayton

A flip cover and antenna assembly for a portable phone is disclosed as being rotatably coupled to a main housing thereof. The flip cover and antenna assembly includes a first flip cover housing, a second flip cover housing matable with the first flip cover housing, and an antenna element positioned between the first and second flip cover housings. The antenna element further includes a ground plane bonded to the ground plane first surface. A dielectric foam is positioned over any remaining area of the ground plane first surface. The first and second flip cover housings have flanges which extend from at least a portion thereof to wrap around corresponding edges of the main housing, which enables extensions of the ground plane to be provided conforming to the flanges. The ground plane may also be patterned in order to control the radiation pattern thereof and limit any interference from other components of the portable phone. The flip cover and antenna assembly may also include a second antenna in the form of a printed circuit antenna or a monopole antenna.

Flip cover and antenna assembly for a portable phone

A portable phone is disclosed as including a main housing, circuitry located within the main housing for operating the portable phone in a designated mode of communication, a support bracket assembly detachably coupled to the main housing, a flip cover rotatably secured to the support bracket assembly about a first axis, and an antenna coupled to the circuitry for transmitting and receiving signals in the designated communication mode associated with the flip cover. The flip cover is also rotatable about a second axis with respect to the support bracket assembly, which is substantially perpendicular to the first axis. The support bracket assembly includes a support bracket having a slotted portion at one end sized to receive an end of the main housing, a latching mechanism for coupling the support bracket to the main housing, a hinge mechanism located at the other end of the support bracket to rotatably couple the support bracket to the flip cover about the first axis, and a yoke having an annular step which captures the flip cover so it can rotate about the second axis. The designated mode of communication may be cellular and/or satellite.

Detachable flip cover assembly for a portable phone

A hands-free headset includes first and second earpieces and is configured such that the second earpiece is integrally mounted to and stowed against the first earpiece during mono-communications operation or during storage. The headset includes two retractable cords which engage with a portable communications device. A sliding grommet attached to the retractable cords controls the separation of the cords and facilitates the two cords being reeled into a common cord reel. The headset also includes a switch which directs the desired electrical path to either stereo listening or communications operation. The headset further includes a docking platform which can be attached to the body of the portable communications device for storage and which holds the integral mounted earpieces against the cord storage reel for an aesthetic stowed hands-free device.

Hands-free headset with stowable stereo earpiece

Radiotelephones include flat blade antennas and flip configurations. The flat blade antenna and flip are mounted to the radiotelephone via dual hinges. The flat blade antenna is configured to be captured by the flip to define a cover in the stow position. The flat blade antenna rotates separate from the flip. The flat blade antenna opens to an angular position greater than the adjacently mounted flip.

Flat blade antenna and flip engagement and hinge configurations

Flat blade antenna and flip mounting structures and associated methods include biasing the flat blade antenna to travel beyond a predetermined angle of rotation to separate from the flip in the open position. The flat blade antenna and flip are mounted to the radiotelephone via dual hinges and have low turning force components which provide a predetermined force vector to facilitate the blade antenna opening to a desired operative position. The flat blade antenna rotates separate from the flip. The flat blade antenna can open to an angular position greater than the adjacently mounted flip. The biasing mounting configuration provides turning forces which facilitates both the opening and closing of the antenna.

Flat blade antenna and flip mounting structures

An antenna assembly has a shaft element with first and second ends. The antenna assembly also has a tube-like element disposed about the first end of the shaft element which tube-like element acts as a matching structure for the antenna assembly and strengthens and rigidifies the antenna assembly to resist bending of the shaft element proximate to the first end thereof. The antenna assembly further has a dielectric material disposed between the tube-like element and the shaft element at the first end. Moreover, the antenna assembly may be combined with a housing to form a radio-communication assembly, the housing having a surface with an edge, the tube-like element acting as a matching structure and strengthening and rigidifying the antenna assembly to resist bending of the shaft element at a fulcrum defined by the edge. Furthermore, a method reconfiguring an antenna on a radio-communication assembly is provided.

Radio frequency antenna

A shielding and thermal dissipation structure for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. A plastic housing overlays the at least one electronic component, and includes an outer periphery defining a housing interior and substantially surrounding the outer periphery of the at least one electronic component. A closed end on one side of the housing outer periphery has an interior surface facing the at least one electronic component with a metal coating about 5 microns thick on the interior surface. The metal coating is chosen from the group of nickel and gold. An electrically conductive gel in the housing interior about the plastic housing outer periphery (and preferably including carbon particles or carbon fibers) is in intimate contact with the distribution circuit and the metal coating. And a thermally conductive gel is disposed between the at least one electronic component and the housing closed end interior surface, and preferable includes particles of at least one of the group of aluminum oxide, aluminum nitride, and boron nitride.

Gel structure for combined EMI shielding and thermal control of microelectronic assemblies

An integrated circuit includes an integrated circuit die having first and second opposing faces, a plurality of spaced apart bonding regions on the first face, and at least one groove in the second face. The at least one groove allows the die to flex upon application of stress to the bonding regions due to thermal cycling of the integrated circuit die, compared to absence of the at least one groove. Preferably, multiple grooves are provided, a respective one of which extends between a respective pair of adjacent spaced apart bonding regions. The grooves may be fabricated by sawing and/or etching the grooves in the second face. The sawing and/or etching may be performed at the wafer stage, before the integrated circuit dies are singulated. Alternatively, the sawing and/or etching may take place after the integrated circuit dies are singulated from the wafer.

Integrated circuit dies including thermal stress reducing grooves and microelectronic packages utilizing the same

Flip and blade antenna for radiotelephone

A thin flexible antenna has radiating elements made of thin nickel-titanium, a highly flexible and rigid alloy. The radiating elements are covered with silicone elastomer dielectric layers that have suitable elongation properties to withstand extreme bending stresses outer jackets cover the antenna. The outer jackets have a textured exterior surface that evenly distributes the bending stresses across the antenna.

Rigid and flexible antenna

A termination contact for an antenna that has a Ni--Ti radiating element is formed by a layer of electrically conductive carbon filler disposed on the Ni--Ti radiating element. A conductive element is positioned on the layer of conductive carbon filler to provide electrical interface between the Ni--Ti radiating element and external RF circuitry. In to prevent contamination, a protective layer of silicon elastomer covers the conductive layer and the Ni--Ti radiating element such that a portion of the conductive element is exposed to provide a RF feed point.

Termination contact for an antenna with a nickel-titanium radiating

Flexible diversity antennas having gain and bandwidth capabilities suitable for use within small communications devices such as radiotelephones are provided. A core of flexible material has an electrical conductor embedded therewithin in a meandering pattern and is surrounded by a first layer of flexible dielectric material. At one end of the antenna, the first layer of dielectric material is surrounded by flexible conductive material. The flexible conductive material is surrounded by a second layer of flexible dielectric material. The portion of the antenna surrounded by conductive material serves as a tuning element, and the portion of the antenna not surrounded by conductive material serves as a radiating element. A flexible signal feed is integral with the antenna and extends outwardly from the flexible core.

Flexible diversity antenna

A shield for an electronic device having a pair of cooperating printed circuit boards includes an integrated connector for connecting the printed circuit boards. The shield is provided with a frame attachable between the circuit boards and structure attached to the frame for supporting a connector that electrically connects the circuit boards. In one embodiment, the contacts of the connector are embedded in a sub-frame attached to the frame. In another embodiment, a connector holder is formed with the frame for supporting a connector that connects the printed circuit boards. By virtue of the unitary structure, problems associated with tolerance stack-up can be eliminated, and usable printed circuit board area can be maximized.

Board to board RF shield with integrated connector/connector holder and

A shock and vibration attenuating structure and method is provided for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. The shock and vibration attenuating structure includes a layer of elastomer material adapted to overlay the distribution circuit and substantially conform to the at least one electronic component. The layer includes a negative image of at least part of the at least one electronic component to allow the elastomer material to envelope the at least part of the at least one electronic component, and at least one relief formed in the elastomer material. The at least one relief is spaced from the negative image of the at least one electronic component and has a predetermined size, shape, and location in the elastomer material selected to protect the electronic component from shock and vibration induced loads and deflections with the layer overlaying the electronic assembly.

Shock and vibration attenuating structure for an electronic assembly

An apparatus and method for packaging a microelectronic device to be connectable to a distribution circuit. The apparatus is in the form of a microelectronic package including a microelectronic device having first and second oppositely facing surfaces and a plurality of Input/Output pads on the first surface capable of being electrically interconnected to a distribution circuit, a base adapted to support the microelectronic device in a predetermined operative relationship to a distribution circuit, and a first layer of elastomer gel sandwiched between the first surface and the base. The first surface of the microelectronic device overlays the base so as to allow an electrical interconnection through the base between the microelectronic device and a distribution circuit.

Growing community of inventors

Apex, NC, United States of America

James D MacDonald, Jr