Texas Instruments Corporation

Eastman-kodak Company

Cavendish Kinetics Limited

Qorvo Us, Inc.

Texas Instruments Information

James D Huffman

Richard Lee Knipe

John Andrew Lebens

Robertus Petrus Van Kampen

Rodney Dean Miller

Gary Alan Kneezel

James Alan Katerberg

Robert E Meier

David P Trauernicht

Keith Edmund Kunz

Cong Quoc Khieu

Patrick Ian Oden

Rabah Mezenner

Anthony DiCarlo

Weibin Zhang

Yongcai Wang

Hrishikesh Vijaykumar Panchawagh

Yonglin Xie

Carolyn Rae Ellinger

Jeremy M Grace

James M Florence

Qing Yang

James Norman Hall

Michael Frank Baumer

Duane E Carter

Mickael Renault

Lance W Barron

Vikram Joshi

Robert E McCovick

David A Rothenbury

Shibajyoti Ghosh Dastider

Brian L Ray

Henry C Chu

Christopher Newell Delametter

Donald B Doherty

Larry J Hornbeck

Wei-Yan Shih

Ray Myron Parkhurst

Roberto Gaddi

Austin L Huang

Frank C Sulzbach

Michael A Mignardi

Henry W Trombley

Brett A Mangrum

Jacques Marcel Muyango

Maria J Lehmann

Jack C Smith

Mark F Reed

Chenhui Niu

Paulo Pinheiro

Karl F Smayling

Jianbai Wang

Thomas J Meyer

Brian K Dodge

Mark K Fletcher

G Sreenivas

Eric A Schmidt

Willibrordus G M Van Den Hoek

A method of manufacturing a MEMS device. The MEMS device has a cavity in which a beam will move to change the capacitance of the device. After most of the device build-up has occurred, sacrificial material is removed to free the beam within the MEMS device cavity. Thereafter, exposed ruthenium contacts are exposed to fluorine to either: dope exposed ruthenium and reduce surface adhesive forces, form fluorinated Self-Assembled Monolayers on the exposed ruthenium surfaces, deposit a nanometer passivating film on exposed ruthenium, or alter surface roughness of the ruthenium. Due to the fluorine treatment, low resistance, durable contacts are present, and the contacts are less susceptible to stiction events.

Anti-stiction enhancement of ruthenium contact

The present disclosure generally relates to the combination of MEMS intrinsic technology with specifically designed solid state ESD protection circuits in state of the art solid state technology for RF applications. Using ESD protection in MEMS devices has some level of complexity in the integration which can be seen by some as a disadvantage. However, the net benefits in the level of overall performance for insertion loss, isolation and linearity outweighs the disadvantages.

ESD protection of MEMS for RF applications

The present disclosure generally relates to the design of a MEMS ohmic switch which provides for a low-impact landing of the MEMS device movable plate on the RF contact and a high restoring force for breaking the contacts to improve the lifetime of the switch. The switch has at least one contact electrode disposed off-center of the switch device and also has a secondary landing post disposed near the center of the switch device. The secondary landing post extends to a greater height above the substrate as compared to the RF contact of the contact electrode so that the movable plate contacts the secondary landing post first and then gently lands on the RF contact. Upon release, the movable plate will disengage from the RF contact prior to disengaging from the secondary landing post and have a longer lifetime due to the high restoring force.

MEMS RF-switch with near-zero impact landing

The present invention generally relates to a mechanism for making a MEMS switch that has a robust RF-contact by avoiding currents to run through a thin sidewall in a via from the RF-contact to the underlying RF-electrode.

Contact in RF-switch

The present invention generally relates to a mechanism for testing a MEMS hysteresis. A power management circuit may be coupled to the electrodes that cause the movable plate that is disposed between the electrodes in a MEMS device to move. The power management circuit may utilize a charge pump, a comparator and a resistor ladder.

Internally generated DFT stepped hysteresis sweep for electrostatic MEMS

The present invention generally relates to a method of operating a MEMS DVC while minimizing impact of the MEMS device on contact surfaces. By reducing the drive voltage upon the pull-in movement of the MEMS device, the acceleration of the MEMS device towards the contact surface is reduced and thus, the impact velocity is reduced and less damage of the MEMS DVC device occurs.

Method and technique to control MEMS DVC control waveform for lifetime enhancement

The present invention generally relates to a DVC having a charge-pump coupled to a MEMS device. The charge-pump is designed to control the output voltage delivered to the electrodes, such as the pull-in electrode or the pull-off electrode, that move the switching element within the MEMS device between locations spaced far from and disposed closely to the RF electrode.

Two-state charge-pump control-loop for MEMS DVC control

A method of ejecting a drop of fluid includes providing a fluid ejector. The fluid ejector includes a substrate, a MEMS transducing member, a compliant membrane, walls, and a nozzle. The substrate includes a cavity and a fluidic feed. A first portion of the MEMS transducing member is anchored to the substrate. A second portion of the MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. The compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member, A second portion of the compliant membrane being anchored to the substrate. Walls define a chamber that is fluidically connected to the fluidic feed. At least the second portion of the MEMS transducing member is enclosed within the chamber. A quantity of fluid is supplied to the chamber through the fluidic feed. An electrical pulse is applied to the MEMS transducing member to eject a drop of fluid through the nozzle.

Fluid ejection using MEMS composite transducer

A microfluidic device includes a substrate; at least one inorganic layer provided on the substrate; a patterned epoxy layer formed over the at least one inorganic layer, the patterned epoxy layer including a wall that defines a location for a fluid in the microfluidic device; and an alkoxysilane material containing a primary or secondary amine for promoting adhesion between the at least one inorganic layer and the patterned epoxy layer.

Microfluidic device having improved epoxy layer adhesion

An ultrasonic transmitter and receiver includes a MEMS composite transducer. The MEMS composite transducer includes a substrate. Portions of the substrate define an outer boundary of a cavity. A first MEMS transducing member includes a first size. A first portion of the first MEMS transducing member is anchored to the substrate. A second portion of the first MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. A second MEMS transducing member includes a second size that is smaller than the first size of the first MEMS transducing member. A first portion of the second MEMS transducing member is anchored to the substrate. A second portion of the second MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. A compliant membrane is positioned in contact with the first and second MEMS transducing members. A first portion of the compliant membrane covers the first and second MEMS transducing members. A second portion of the compliant membrane is anchored to the substrate.

Ultrasonic transmitter and receiver with compliant membrane

An energy harvesting device includes a MEMS composite transducer. The MEMS composite transducer includes a substrate. Portions of the substrate define an outer boundary of a cavity. A MEMS transducing member includes a beam having a first end and a second end. The first end is anchored to the substrate and the second end cantilevers over the cavity. A compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member. A second portion of the compliant membrane is anchored to the substrate. The compliant member is configured to be set into oscillation by excitations produced externally relative to the energy harvesting device.

Energy harvesting device including MEMS composite transducer

A method of harvesting energy from the environment includes providing an energy harvesting device. The energy harvesting device includes a MEMS composite transducer. The MEMS composite transducer includes a substrate. Portions of the substrate define an outer boundary of a cavity. A MEMS transducing member includes a beam having a first end and a second end. The first end is anchored to the substrate and the second end cantilevers over the cavity. A compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member. A second portion of the compliant membrane is anchored to the substrate. The energy harvesting device is configured so that the compliant membrane is set into oscillation by excitations produced external to the energy harvesting device. The MEMS transducing member is caused to move into and out of the cavity by the oscillating compliant membrane. The motion of the MEMS transducing member is converted into an electrical signal.

Energy harvesting using MEMS composite transducer

Operating an ultrasonic transmitter and receiver includes providing a MEMS composite transducer. The MEMS composite transducer includes a substrate. Portions of the substrate define an outer boundary of a cavity. A first MEMS transducing member includes a first size. A first portion of the first MEMS transducing member is anchored to the substrate. A second portion of the first MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. A second MEMS transducing member includes a second size smaller than the first size of the first MEMS transducing member. A first portion of the second MEMS transducing member is anchored to the substrate. A second portion of the second MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. A compliant membrane is positioned in contact with the first and second MEMS transducing members. A first portion of the compliant membrane covers the first and second MEMS transducing members. A second portion of the compliant membrane is anchored to the substrate. Electrical pulses are sent to the first MEMS transducing member which causes the first MEMS transducing member and the compliant membrane to vibrate. The vibrations of the first MEMS transducing member and the compliant membrane are transmitted to an object. Echo signals are received from the object. The received echo signals are converted into electrical signals by the second MEMS transducing member.

Method of operating an ultrasonic transmitter and receiver

A method for making a microfluidic device, the method includes providing at least one inorganic layer on a substrate; applying an alkoxysilane material containing a primary or secondary amine on the at least one inorganic layer; baking the applied alkoxysilane material at a temperature greater than 130 degrees C.; applying an epoxy material to form an epoxy layer, wherein the applied alkoxysilane material is disposed at an interface between the epoxy layer and the at least one inorganic layer; and patterning the epoxy layer to provide a wall for defining a location for a fluid in the microfluidic device.

Making a microfluidic device with improved adhesion

A MEMS composite transducer includes a substrate, a MEMS transducer, and a compliant membrane. Portions of the substrate define an outer boundary of a cavity. A first portion of the MEMS transducing member is anchored to the substrate. A second portion of the MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. The compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member and a second portion of the compliant membrane is anchored to the substrate.

MEMS composite transducer including compliant membrane

Growing community of inventors

Pittsford, NY, United States of America

James D Huffman