Ceramics Process Systems Corporation

Cps Superconductor Corp.

James D Hodge

Eric A Barringer

Sheldon I Lieberman

Mark S Schmidt

Brian C Foster

John W Halloran

Roger S Lind

Richard Waack

Donald J Kelley

William C Gruber

Lori J Klemptner

Brian W Saxton

An improved process for preparing superconducting ceramic powder includes calcining superconducting precursor compounds in an atmosphere having a controlled amount of oxygen, generally not more than that found in air, the remainder of the atmosphere composed of a gas or mixture of gases inert with respect to the ceramic. A preferred process includes forming the precursor compounds into a slurry, granulating the slurry, drying the granules (a binder can be added to the slurry to promote green strength), and calcining in the controlled atmosphere to provide the desired HTSC (high temperature superconductor) composition.

Method for preparation of superconductor powders

Glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns are obtained by co-sintering a glass-ceramic composite and copper, silver, palladium, gold, based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems include composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process. The package is fabricated using a tape specifically designed for clean binder burnout in a reducing atmosphere at low temperatures and also for superior mechanical and thermal properties. Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.

Co-fired metal-ceramic package

A tungsten paste suitable for co-sintering with 98+% alumina substrate can be produced by adding selected compositions of glass to the paste. Circuit packages produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish. A preferred embodiment of the invention utilizes a substrate comprising narrow size range alumina powder, thus yielding lower sintering temperature and further improvements in shrinkage variability and surface finish.

Tungsten paste for co-sintering with pure alumina and method for

This invention relates to glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns obtained by co-sintering a glass-ceramic composite and copper, silver, palladium or gold based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems disclosed herein contains composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process.

Method for producing materials for co-sintering

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Medway, MA, United States of America

James D Hodge