Adc Telecommunications, Inc.

James D Dewey

Roy Lee Henneberger

Ahmad R Sajadi

Dominic Joseph Louwagie

Scott K Baker

Dennis M Burroughs

Todd A Morgenstern

Harvey J Chouanard

Larry William Gonier

Karl H Pohl

Daniel Rivera, Sr

Patrick J Brickley

Soutsada Vongseng

Jeffrey Louis Peters

Duane R Sand

George B Pfeffer

Bruce Musolf

John M Stasny

Douglas G Elliot

James D Bradley

Ryan L Lindquist

Thomas Good

Kevin A Rademacher

John S Bonnesen

Dominic L Louwagie

Randall Wendland

John M Field

Steven L Carolus

Jose Luis Gonzalez Blazquez

Matthew G Pedersen

Hans-Georg Grosse-Boes

Ernest R Beaudet

Steven W Fields

Jeffery O Brown

Daniel J Murphy

Bruce R Musolf

Ahmed Sajadi

The present disclosure relates to a jack assembly including a jack mount having a front side and a rear side. A jack of the assembly is adapted to be slidably mounted in a jack receiving region of the jack mount. The jack assembly also includes a plurality of cross-connect contacts, and a rear interface assembly. The rear interface assembly includes a dielectric cover piece and a plurality of rear connectors that project outward from the dielectric cover piece.

Jack assembly with vertically staggered jack bores

Horizontally aligned jack mounts with vertically staggered jack bores

Jack mount with jacks with normal contacts and vertically staggered jack bores

A DSX system having a plurality of jacks mounted in a chassis, the jacks including IN and OUT ports accessible from the front of the chassis and tip and ring springs corresponding to each of the IN and OUT ports. The chassis also includes IN and OUT co-axial cable connectors electrically connected to the tip and ring springs of the jacks, and MONITOR co-axial cable connectors for use in monitoring signals transmitted through the IN and OUT connectors.

DSX module with performance monitoring

Jack assembly arrangement with staggered jack bores

The disclosure relates to a jack assembly including a jack mount for slidably receiving a jack that includes a plurality of conductive tip and ring springs. When plugs are received, the tip springs make electrical contact with tip contacts of the plugs and the ring springs make electrical contact with ring contacts of the plugs. When plugs are not received, the tip and ring springs make contact with normal contacts of the jack. The jack assembly also includes cross-connect contacts and a rear interface assembly. The rear interface assembly includes a dielectric support and a plurality of coaxial connectors projecting outwardly therefrom away from the jack mount. A circuit board is positioned between the jack mount and the dielectric support. The coaxial connectors are electrically connected to baluns mounted on a second circuit board mounted within the dielectric support. The second board is electrically connected to the first board by dual compliant pins. Electrical connections are established between the coaxial connectors and the tip and ring springs when the rear interface assembly is secured to the jack mount.

Flex-X module with board mounted baluns

Jack assembly

A performance monitoring access device for a DSX system is disclosed herein. The monitoring device provides connection locations for readily connecting digital equipment to performance monitoring equipment. The monitoring devices allows for dual performance monitoring of digital equipment.

Device for providing dual monitoring of digital equipment

A DSX system arranged to receive a plurality of high-density chassis is disclosed. The chassis include back planes having rear access IN/OUT fields and rear access cross-connect fields. The rear access fields are electrically connected to termination panels located in respective IN/OUT regions and cross-connect regions. Each of the regions includes cable management channels within which system cables are routed.

High density DSX system

Jack insert assembly with cross-connect contacts

A patching system is disclosed herein. The patching system includes a plurality of front-loaded patching modules positionable within a chassis. Each of the patching modules includes first and second longframe jack assemblies and a switch for changing the circuit configurations of the patching module. The patching modules and the chassis provide increased patching density.

High density patching system with longframe jacks

A DSX system for receiving removable jack inserts is disclosed. The system includes a plurality of chassis rearward facing cross-connect arrays and rearward facing IN/OUT arrays. A first circuit board section and a second circuit board section are electrically connected to the arrays. The first circuit board section is positioned behind the removable jack inserts. The second circuit board section is positioned behind the first circuit board section and in front of the cross-connect array and the IN/OUT array.

Rear access DSX system

Growing community of inventors

Plymouth, MN, United States of America

James D Dewey