Qualcomm Incorporated

James D Burrell

Zhongping Bao

Liang Cheng

Shiqun Gu

Jon James Anderson

Damion B Gastelum

Gary D Good

Mohammed A Tantoush

Pillars having a directed compliance geometry are arranged to couple a semiconductor die to a substrate. The direction of maximum compliance of each pillar may be aligned with the direction of maximum stress caused by unequal thermal expansion and contraction of the semiconductor die and substrate. Pillars may be designed and constructed with various shapes having particular compliance characteristics and particular directions of maximum compliance. The shape and orientation of the pillars may be selected as a function of their location on a die to accommodate the direction and magnitude of stress at their location. A method includes fabricating pillars with particular shapes by patterning to increase surface of materials upon which the pillar is plated or deposited.

Interconnect pillars with directed compliance geometry

At least one feature pertains to an apparatus having passive thermal management that includes an integrated circuit die, a heat spreader thermally coupled to the integrated circuit die, a phase change material (PCM) thermally coupled to the heat spreader, and a molding compound that encases the heat spreader and the PCM. In one example, the heat spreader may include a plurality of fins, and at least a portion of the PCM is interposed between the plurality of fins. Another feature pertains to an apparatus that includes an integrated circuit die, and a molding compound having a phase change material intermixed therein. The resulting molding compound completely encases the die.

Thermal management of integrated circuits using phase change material and heat spreaders

Various embodiments of methods and systems for heuristic determination and thermal analysis of component placement on a printed circuit board ('PCB') for use in a portable computing device ('PCD') are disclosed. It is an advantage of embodiments that thermal energy generating components, such as processors, may be heuristically selected and arranged on a selected PCB according to varying layouts and combinations and then evaluated for thermal dissipation efficiency under an assortment of use case scenarios. In this way, users of the system and method may quickly narrow down commercially feasible component layouts, identify the most efficient layouts and then heuristically modify the layouts to develop an optimal arrangement.

System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing device

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San Diego, CA, United States of America

James D Burrell