Siemens Energy, Inc.

Siemens Westinghouse Power Corporation

Siemens Power Generation, Inc.

Eaton Corporation

Northrop Grumman Systems Corporation

James D B Smith

Gary C Stevens

John William Wood

Franklin T Emery

Karl F Schoch, Jr

Theodore R Vasilow

Peter Groeppel

F Tim Emery

Andreas Lutz

Daryl R Stough

James W Wood

The present invention provides for a resin mixture that comprises a highly structured resinand a less structured resin. The highly structured resinand the less structured resinare mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.

Seeding resins for enhancing the crystallinity of polymeric substructures

Polymer brushes () in a resin that create phonon pathways therein. The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment ().

Polymer brushes

The present invention provides for high thermal conductivity paper that comprises a host matrix (), and high thermal conductivity materials () added to a surface of the host matrix in a specific pattern (). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.

Patterning on surface with high thermal conductivity materials

A method for the treatment of micro pores within a mica paper that includes: obtaining a silane with a molecular weight of between approximately 15 and 300, adding the silane to the mica paper, and reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores with the mica paper through the silane. In one embodiment, the mica paper is compressed by an amount between 5% and 30% of its original thickness. In another embodiment, the mica paper is compressed both prior to reacting the silane and during impregnation with the resin.

Treatment of micropores in mica materials

A high thermal conductivity resin that is made up of a host resin matrix () and high thermal conductivity fillers () that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell () around the high thermal conductivity fillers (), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells () is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

Nano and meso shell-core control of physical properties and performance of electrically insulating composites

An electrical insulation paper that is made of mica flakelets (), having an average size range of 0.01 to 0.05 mm in their thinnest dimension, hexagonal boron nitride (), which has an average size range of 10 to 1,000 nm in their longest dimension, and a resin matrix. The mica flakelets and the hexagonal boron nitride are mixed and formed into a paper (), and the resin is added to the paper after formation, the ratio by weight of the hexagonal boron nitride to the mica flakelets is directly proportional to the average size of the hexagonal boron nitride compared to the average size of the mica flakelets, within an adjustment factor.

Multi-layered platelet structure

In one embodiment of the present invention as used for impregnating a composite tape () with HTC particles provides for permeating a fabric layer () of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape through the fabric layer (). At least 5% of the HTC particles permeated into the fabric layer are carried out of the fabric layer and into a mica layer () bound to the fabric layer by the impregnating resin. In some embodiments the impregnating resin itself contains HTC particles.

Composite insulation tape with loaded HTC materials

In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix with a first class of grafted high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted high thermal conductivity particles that are not directly grafted the host resin matrix. The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.

Mix of grafted and non-grafted particles in a resin

The present invention provides for high thermal conductivity paper that comprises a host matrix (), and high thermal conductivity materials () added to a surface of the host matrix in a specific pattern (). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers may have patterning.

In one embodiment the present invention provides for a method of forming HTC dendritic fillerswithin a host resin matrix that comprises adding HTC seedsto the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillerswithin the host resin matrix.

Seeding of HTC fillers to form dendritic structures

The present invention relates to homogeneous alumoxane-LCT-epoxy polymers and methods for making the same. The homogeneous alumoxane-LCT-epoxy polymers comprise alumoxane-containing sub-structures evenly dispersed and essentially completely co-reacted with the LCT-epoxy sub-structures. The alumoxane sub-structures are organically bonded to the LCT-epoxy sub-structures. This produces homogeneous alumoxane-LCT-epoxy polymers that are substantially free of particle wetting and micro-void formation, with improved thermal conductivity properties without compromising on other desired structural integrities.

Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same

An electrically insulated objectwith a heat conduit at the interface between the layers of insulating tape. The tapehas been, surface coated with a high thermal conductivity (HTC) material, so that the interface between the layers of tapeprovides a pathway for the heat to reach the environment. The radiation of heat through the tape layers is also increased by the surface coatings.

Surface coating of lapped insulation tape

The present invention relates to homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials and methods for making the same. The homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials comprise HTC-oligomer sub-structures evenly dispersed and essentially completely co-reacted with the LCT-epoxy sub-structures, where the HTC-oligomer sub-structures are organically bonded to the LCT-epoxy sub-structures. This produces homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials that are substantially free of particle wetting and micro-void formation, with improved thermal conductivity properties without compromising on other desired structural integrities.

LCT-epoxy polymers with HTC-oligomers and method for making the same

The present invention comprises a polymeric epoxy patching resin containing metal intercalated AlSiO structures. The AlSiO structures are typically nanoclays, and the preferred metals are Cr, Sn and Zn, and mixtures thereof. The patching resin is applied to damaged mica tapes, where the metal intercalated nanoclays penetrate the damaged area, leaving a homogenous patch. The present invention may also be used to thicken an area of insulating tape.

Growing community of inventors

Monroeville, PA, United States of America

James D B Smith