Eastman Chemical Company

Intel Corporation

University of South Carolina

Amcol International Corporation

Eastman Chemical Corporation

James Christopher Matayabas, Jr

John Walker Gilmer

Robert Boyd Barbee

Sam Richard Turner

Tie Lan

Gary Wayne Connell

Vasiliki Psihogios

Stephen Neal Falling

Shriram Bagrodia

Paul A Koning

Jeffrey Todd Owens

Peter B MacKenzie

Sabina J Houle

Rodney Layne Piner

Jack Wesley Trexler, Jr

Linda Gail Bernard

Laughlin G McCullough

John Anthony Hyatt

Stephen A Godleski

Patricia Lopez-Maldonado

Max Allen Weaver

Bobby J Sublett

Mark Edward Stewart

Michael John Cyr

Shankar Devasenathipathy

Kyle Jordan Arrington

Joseph B Petrini

Jerrod Peterson

Mostafa A Aghazadeh

Horst Clauberg

Emerson Eston Sharpe, Jr

Aaron McCann

James T Tanner, Iii

Falling: Stephen N

Robert M Finch

To address technical problems facing silicon transient thermal management, a thermal interface material (TIM) may be used to provide improved thermal conduction. The TIM may include a liquid metal (LM) TIM, which may provide a significant reduction in thermal resistance, such as a thermal resistance R&#x2248;0.01-0.025&#xb0; C.-cm2/W. The LM TIM may be applied using a presoaked applicator, such as an open-cell polyurethane foam applicator that has been presoaked in a controlled amount of LM TIM. This LM presoaked applicator is then used to apply the LM TIM to one or more target thermal surfaces, thereby providing thermal and mechanical coupling between the LM TIM and the thermal surface. The resulting thermal surface and thermally conductive LM TIM may be used to improve thermal conduction for various silicon-based devices, including various high-power, high-performance system-on-chip (SoC) packages, such as may be used in portable consumer products.

Liquid metal thermal interface material application

Liquid crystalline epoxy compounds, compositions including the compounds, and methods of using the compositions are disclosed. In one aspect, an epoxy compound may have a melting point that is less than 140&#xb0; C. and may be liquid crystalline at a temperature greater than 150&#xb0; C.

Microelectronic device having liquid crystalline epoxy resins

A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.

Thermal interface structure with integrated liquid cooling and methods

Liquid crystalline epoxy resins

An embodiment of a phase change TIM of this invention comprises a polyester matrix with melting temperature near or below operating temperature (typically less than about 130&#xb0; C.), thermally conductive filler with bulk thermal conductivity greater than about 50 W/mK, and optionally other additives. The polyester resin has improved thermo-oxidative stability compared to the polyolefin resins, thereby providing improved reliability performance during test.

Phase change thermal interface materials including polyester resin

This application discloses an apparatus comprising a substrate including a plurality of conducting layers and a nanocomposite inter-layer dielectric (ILD) sandwiched between the conducting layers, wherein the nanocomposite ILD layer comprises a nanocomposite including a polymer having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Also disclosed is an apparatus comprising a substrate having a contact surface and a nanocomposite solder resist layer placed on the contact surface, wherein the solder resist comprises a nanocomposite including a polymer binder having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Further disclosed is a process comprising providing a plurality of conducting layers and sandwiching a nanocomposite inter-layer dielectric (ILD) between the conducting layers, wherein the nanocomposite ILD layer comprises a nanocomposite including a polymer binder having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Other apparatus and process embodiments are also disclosed and claimed.

Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist

A method of constructing a microelectronic assembly as provided. A mold piece is locating over a microelectronic die carrying an integrated circuit. An encapsulant is injected into a space defined between surfaces of the mold piece and the microelectronic die. The encapsulant includes a liquid phase epoxy and a solid phase catalyst compound when injected. The encapsulant mixture is heated in the space to a temperature where the catalyst compound becomes a liquid and cures the epoxy. The catalyst compound may, for example, be polystyrene and the catalyst may be diphenyl phosphine. The catalyst compound is then heated to above its glass transition temperature so that the diphenyl phosphine is released from the polystyrene. The diphenyl phosphine then cures the epoxy. The epoxy is preferably a liquid at room temperature.

Encapsulant mixture having a polymer bound catalyst

A thermal interface material is a nanocomposite phase change thermal interface material that includes one or more matrix polymers, one or more thermally conductive fillers, and one or more clay materials. An electronic device includes at least two surfaces joined using the nanocomposite phase change thermal interface material that includes one or more matrix polymers, one or more thermally conductive fillers, and one or more clay materials.

Phase change thermal interface materials including exfoliated clay

Polymer composite materials comprising of least one polymer resin and platelet particles from at least one layered silicate material uniformly dispersed in the resin and articles prepared from the polymer composite materials. The polymer composite contains at least one polyamide resin, at least one oxygen scavenging system, and at least one layered silicate material. These polymer composite materials are especially useful for manufacturing clear polyester bottles and polyester film that are recyclable have improved active gas barrier properties to oxygen, and have improved passive barrier properties to carbon dioxide and other gases. The polymer composite materials can be used in relatively minor amounts as either a blend or a coextruded thin layer with virgin or post consumer recycled polyesters and related copolymners.

Polyamide nanocomposites with oxygen scavenging capability

Process for preparing high barrier nanocomposites

This invention relates to a polymer-clay nanocomposite comprising (i) a melt-processible matrix polymer, and incorporated therein (ii) a mixture of at least two layered clay materials. The invention also relates to articles produced from a nanocomposite and a process for preparing a nanocomposite.

Polymer/clay nanocomposite comprising a clay mixture and a process for making same

This invention is directed to a polymer-clay nanocomposite, products produced from the nanocomposite, and a process for preparing a polymer-clay nanocomposite. The polymer-clay nanocomposite comprises (a) a matrix polymer, (b) an amorphous oligomer, and (c) a layered clay material.

Polymer-clay nanocomposite comprising an amorphous oligomer

Process for preparing a high barrier amorphous polyamide-clay nanocomposite

Growing community of inventors

Chandler, AZ, United States of America

James Christopher Matayabas, Jr