Simon Industries, Inc.

Other

James Christopher Caylor

Mark Roger Pelillo

David R F Stone

Moses Ray Jensen

Zhifeng Ren

Gang Paul Chen

Shuo Chen

Bed Poudel

Xiao Yan

Giri Joshi

Zachariah Green Renn

Basil Tsiaousopoulos

A releasable clamping device is provided. The device includes a plurality of wedge members that slidably are disposed upon a carrier, with an input disposed in conjunction with a first wedge member. The input interacts with a projection and when the input is moved the first wedge members slides along the carrier. Motion of the first wedge member causes vertical motion of the second and fourth wedge members, which in combination cause the thickness of the releasable clamping device to increase, which frictionally retains the carrier and associated components thereon (such as a PCB) within a housing. The input may be moved in an opposite direction which causes the first wedge member to slide along the carrier in an opposite direction and causes the second and fourth wedge members to vertically move toward the carrier thereby narrowing the overall thickness of the device to allow removal of the carrier.

Wedge clamp for circuit board

A wedge clamp is provided. The wedge clamp includes wedge members aligned with a shaft and in sliding contact with surfaces of the neighboring wedge members. Some of wedge members each include a finger and a void, with the finger of a first member slidably inserted within the void of a second wedge member and vice versa. The fingers and voids extend at an acute angle, and the fingers and voids of other wedge members extend at another acute angle on an opposite side of a vertical axis. When the shaft is rotated some wedge members vertically translate with respect to the remaining wedge members. When the shaft is rotated in the reverse direction the wedge members translate vertically in the opposite direction returning to an original position. The interaction of the fingers and voids mechanically drive the moved wedge members into the original state.

Thermoelectric materials and methods of making thermoelectric materials having a nanometer mean grain size less than 1 micron. The method includes combining and arc melting constituent elements of the thermoelectric material to form a liquid alloy of the thermoelectric material and casting the liquid alloy of the thermoelectric material to form a solid casting of the thermoelectric material. The method also includes ball milling the solid casting of the thermoelectric material into nanometer mean size particles and sintering the nanometer size particles to form the thermoelectric material having nanometer scale mean grain size.

Half-heusler alloys with enhanced figure of merit and methods of making

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Flower Mound, TX, United States of America

James Christopher Caylor