Corning Incorporated

James Ching-Ming Hsiao

Gregory A Kirkos

Gordon M Shedd

Carlos Horacio Mastrangelo

ChuanChe Wang

Marc Waelti

Thomas David Kudrle

Mirela Gabriela Bancu

One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices. Other embodiments are directed to methods of depositing a thin film on the back of a MEMS device.

Electrostatically actuated micro-electro-mechanical devices and method of manufacture

Growing community of inventors

Somerville, MA, United States of America

James Ching-Ming Hsiao