Intel Corporation

Other

Radisys Corporation

James C Shipley

Javier Leija

Christopher D Lucero

Christopher A Gonzales

Christopher Wade Ackerman

Ioan Sauciuc

James G Maveety

Ashish Gupta

Michael L Rutigliano

Tolga Acikalin

Christopher Roy Schroeder

Chia-Pin Chiu

Victor Henckel

Craig B Simmons

Anthony Yeh Chiing Wong

Boon Liang Heng

A tape measure device for measuring pipes includes a spring return positioned in a housing. A tape is engaged to and is loopedly positioned around the spring return. The tape is selectively extensible from a front of the housing via a slot. A recess in a bottom of the housing extends from the front to a back and to proximate to the slot. A hook engaged to a second end of the tape can selectively engage a terminus of a substrate, enabling a user grasping the housing in a hand to extend the tape along the substrate. Indicia on the tape allow measurement of a distance from the second end of the tape. A fastener on the bottom of the housing can selectively engage the substrate to removably engage the housing to the substrate so that the user can release the housing.

Tape measure device

An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Airflow control system

In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed.

Active thermal control using a burn-in socket heating element

A method according to one embodiment may include providing a chassis comprising at least one selectively deployable fan disposed within the chassis. The method of this embodiment may also include moving the fan from a stowed configuration to a deployed configuration within the chassis and energizing the at least one fan. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Auxiliary airflow system

In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit airflow therethrough. The apparatus further includes an open region to allow airflow to pass therethrough. At least some of the airflow limited by the at least one restriction region will flow through the open region. The apparatus also includes a connection mechanism to connect to a chassis.

Airflow redistribution device

A method according to one embodiment may include providing a circuit board assembly comprising a circuit board and a rotatable knob and at least one latch coupled to the knob via a linkage. The method of this embodiment may also include moving the at least one latch to a retracted position by rotating the knob, and inserting the circuit board assembly into a chassis. The method may then include moving the latch to an extended position. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.

Circuit board latch system

In general, in one aspect, the disclosure describes an apparatus that includes a latch to connect a board to a chassis. The apparatus further includes a pull lever to control whether said latch is retracted or extended. The latch connects the board to the chassis when it is extended.

Pull lever latch apparatus

A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.

Growing community of inventors

Gilbert, AZ, United States of America

James C Shipley