Applied Materials, Inc.

James C Nystrom

Robert D Tolles

Manoocher Birang

Brian J Brown

Doyle E Bennett

Madhavi R Chandrachood

John H Prince

Stephen J Blumenkranz

Jeffrey S Marks

Sen-Hou Ko

Victor Belitsky

William R Bartlett

Alfred Abraham Goldspiel

Richard V Rafloski

An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.

Groove cleaning device for chemical-mechanical polishing

A chemical mechanical polishing apparatus includes a plurality of concentric rotatable platens for polishing a substrate. A polishing pad is attached to each platen. Each platen may be rotated independently in either clockwise or counter-clockwise direction.

Concentric platens

A carrier head assembly including a drive shaft and a system flange connectable to the drive shaft where the system flange includes a number of magnetic plates. The carrier head assembly also includes a carrier head flange. The carrier head flange has more magnetic plates, these magnetic plates generally facing the previous plates. The magnetic plates magnetically engage to couple the carrier head flange to the system flange.

Magnetic carrier head for chemical mechanical polishing

A conditioner apparatus uses one or more linear conditioners. The linear conditioners extend from the edge of the polishing pad almost to the center of the pad. The conditioner apparatus may use two conditioner rods located on either side of a radial segment. The rods gimbal so that if one rod rises, the other rod is forced downwardly. In addition, the rods can pivot independently about a lateral axis, but they cannot pivot around the vertical axis. The linear conditioners may be actuated by a piezoelectric member or swept by an arm toward and away from the center of the polishing pad.

Linear conditioner apparatus for a chemical mechanical polishing system

A chemical mechanical polishing apparatus has a platen with a cavity with an opening to the top surface of the platen. A polishing pad is located at an upper surface of the platen. A flexible membrane is positioned in the cavity to define a first and a second volume. A pressure source is connected to the second volume to flex the membrane, and a lifting member is positioned in the first volume so that flexing of the membrane extends the lifting member through the opening to lift the substrate off the polishing pad. Alternately, de-ionized water may be forced through a passage in the platen and an aperture in the polishing pad to lift the substrate.

Method and apparatus for removing a substrate from a polishing pad in a

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Palo Alto, CA, United States of America

James C Nystrom