Trw Limited

Other

James C Lau

Richard P Malmgren

Kenneth Lui

Steven S Chan

Ronald A DePace

Robert Bruce Stokes

Alfred Euinam Lee

Alvin M Kong

Kei-Fung Lau

Yoshio Saito

Roger A Davidheiser

James A Hathaway

Maurice Lowery

Michael Roush

Charles C Ruth

Fault tolerance is incorporated within the integral electric heaters of a reworkable electronic semiconductor component, such as a reworkable multi-chip module, to increase production yield and longevity of the rework feature. Components of the foregoing kind contain a multi-layer substrate to bond to a printed wiring board, and, for rework, the component includes a plurality of electric heaters arranged side by side on a bottom layer of the substrate. When energized with current, the heaters generate sufficient heat to weaken the adhesive or solder bond to the printed wiring board without delaminating the layers of the substrate, allowing the electronic semiconductor component to be pulled away from the printed wiring board for rework. Additional circuitry is included to automatically route heater current around, that is bypass, any current-interrupting break(s) as may form in any of the electric heaters giving the heaters a fault tolerance.

Equipotential fault tolerant integrated circuit heater

A bending mechanism for flexible waveguide uses a combination of an elongate arm (1), two short bracket arms (3 & 7) and a gear train (5, 11, 13 & 9) linking the bracket arms to bend a flexible waveguide (24) over a range of positions. The bend is formed to the shape of a circular arc the radius of which varies with the position. Each short bracket arm is pivotally connected (15 & 17) to a respective end of the elongate arm and to a respective one of the waveguide's two end flanges (23 & 25). Each bracket arm contains a gear that rotates with the respective bracket arm about the bracket arm's pivot; and an even number of gears interlinks those gears whereby pivotal movement of one of the flanges in a clockwise direction produces an effective relative pivotal movement of the other flange. The bending mechanism allows for as much as 180 degrees of repetitive reciprocal rotation of one flange relative to the other without imposing significant stress on the flexible waveguide, providing an ideal long lasting interface between a mechanically scanning microwave antenna and a microwave transmitter/receiver.

Apparatus for bending a flexible conduit

The invention relates to a method for producing low cost integrated microwave assemblies, where a photoresist layer is deposited onto a substrate, a portion of the photoresist is selectively removed, a first conductive layer is applied, and, a second portion of the photoresist is removed leaving isolation walls and cavities. Electrical components are placed in the cavities and a first dielectric layer fills the cavities. Vias are created in the first dielectric material exposing the electrical contacts, a second conductive layer is applied into the vias and over the first dielectric material. The second conductive layer is patterned by removing a portion of the second conductive layer creating a signal line pattern in the second conductive layer.

Method of making compact integrated microwave assembly system

A method of fabricating an electrical interconnect are provided. A first transparent dielectric layer is disposed on top of a support structure. A conductive circuit layer is plated above the first dielectric layer. Separate conductive layers are plated on top of the conductive circuit layer to produce conductive vias. A second transparent dielectric layer is disposed around the conductive layers. Contact tips are electrically connected to the top surface of the separate conductive layers. The interconnect may be visually aligned so that the contact tips brought into contact with target connections. In addition, the support structure may be partially removed to allow a flexible interconnect.

Method for manufacturing a massive parallel interconnection attachment

A folding, pedal-driven vehicle having a universal joint transmission system is provided. A human-powered ground vehicle having a motive power input assembly that includes foot pedals to drive a front-wheel of the vehicle through a universal joint drive gear system is also provided. Folding, recumbent vehicles for one or two riders are also provided and each includes a transmission system having a pedal-drive power input assembly pivotally connected to a universal joint which in turn is pivotally connected to a drive connection for driving a front wheel of the vehicle.

Folding, pedal-driven vehicle with universal joint transmission system

This invention discloses a front wheel steering, front wheel drive, light weight, foldable, ground transportation vehicle. The disclosed vehicle is constructed for convenient manual transformation between a deployed operating configuration, for transporting one or more passengers, and a compactly folded position, for facilitating toting the vehicle about as well as stowing it away. Two-wheel and three-wheel versions of the vehicle are set forth. Both such embodiments can utilize basically the same drive and steering constructions.

Human powered ground vehicle

An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible transparent dielectric material which allows vertical flexing of the contacts and visual transparency through the circuit. Alignment markers are provided on the circuit and wafer and one or more viewing tubes may be used to allow a user to view the alignment markers so as to bring the circuit into proper alignment with the wafer. A microscope may further be employed with each viewing tube to provide accurate alignment examination. A stretching fixture is mounted on the circuit which enables a user to stretch the circuit to achieve a larger size when necessary.

Testing device for integrated circuits on wafer

The present invention provides a new and effective method for the sealing and electrical testing of electronic devices; and particularly for surface acoustic wave devices. In accordance with the present invention, the cost and size of making hermetically sealed packages for electronic devices and of electrically testing each device is significantly reduced over the prior art by making use of mass simultaneous sealing and electrical connection at the wafer level, and by using substrates with hermetically sealed and electrically conductive via holes. Further, cost reduction is effected by making use of final electrical testing with wafer probe test techniques before dicing.

Mass simultaneous sealing and electrical connection of electronic devices

An apparatus for mounting a waveguide window or conduction member into a housing such that a smooth gradient of the coefficient of thermal expansion exists between the housing and the window or conduction member, thereby reducing the internal stress which results from ambient temperature variations. The apparatus comprises a frame member for mounting a feedthrough member into a housing. The frame member includes a buffer section having a plurality of sections, each section having a material which progressively varies the coefficient of thermal expansion. The frame member further includes additional stress relief features and structural elements facilitating manufacture and assembly of the apparatus.

Low stress waveguide window/feedthrough assembly

A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material, etching the pattern and creating a plurality of wells extending through the dielectric material and a matching plurality of cavities in the surface of the base, and electroplating the pattern and filling the wells with an electrically conductive electroplate material. The electroplate thereby forms a plurality of conductive members, each extending through the dielectric material. The base is then removed from the dielectric material, thereby forming a connector board having the conductive members extending therethrough for electrically coupling the first and second groups of contact points on the circuit chips.

Method of making connector for integrated circuit chips

A resealable gas concentration sensor for determining the concentration of a particular gas within a gaseous environment. The sensor is constructed of a housing and a cap. The cap is adapted to be temporarily coupled with the housing while in the environment to define a sealed sample chamber, thereby capturing a sample of the environment. A venturi tube having a narrow passage is affixed to the housing which is adapted to allow fluid flow through venturi tube into test equipment for determining the concentration of the gas in the sample. The housing and cap may be repeatedly uncoupled and resealed to capture additional samples and measure other concentrations.

Method of sensing a gas concentration

An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible, supportive dielectric material which allows vertical flexing of the contacts. Cross bar switches are further employed to switch among the plurality of contacts thereby enabling the testing of individual dies of the water to be tested. A microprocessor is further included for controlling the switching and the testing of each die. In an alternate embodiment, the plurality of contacts are mechanically moved relative to the wafer to allow testing of the dies without the need for the switches.

On-wafer integrated circuit electrical testing

An integrated waveguide/stripline signal transition structure and method for fabricating the same are provided for allowing high frequency signal transitions. The signal transition structure includes a waveguide which has a conductive cavity for guiding electromagnetic waves therethrough. A first conductive circuit layer is fabricated within the conductive cavity and is electrically connected thereto. A second conductive signal layer is fabricated within the conductive cavity and is isolated from the conductive cavity and the first conductive signal layer. A plurality of dielectric layers are provided which suspend the first and second conductive signal layers within the conductive cavity. The second conductive signal layer and the conductive cavity thereby allow for signal transitions therebetween. The first and second conductive signal layers and dielectric material are integrally fabricated on top of a removable material which is subsequently removed. In an alternate embodiment, a single dielectric layer is provided for suspending the first and second conductive signal layers. In addition, an array of signal transition structures may be integrally fabricated within a housing structure.

Integrated waveguide/stripline transition

An apparatus for the bending of a flexible conduit having first and second ends includes first and second assemblies which are fixed for relative rotation with the first and second ends. An axis of rotation passes through the first and second assemblies. The apparatus further includes a driven gear fixed for rotation with the first assembly. The driven gear is adapted to cooperate with a drive gear to rotate the first assembly with respect to the second assembly. The first assembly includes a first extendable portion which attaches directly to the first end. Similarly, the second assembly includes a second extendable portion which attaches directly to the second end. The first and second assemblies function to vary the distance between the axis of rotation and the first and second ends as the first assembly is rotated with respect to the second assembly.

This invention discloses a method of fabricating a plurality of diamond semiconductor wafers from a single crystal diamond semiconductor boule, where the diamond boule is grown by a chemical vapor deposition (CVD) process. Initially, a single crystal diamond seed is polished and an impurity layer is deposited on the polished seed crystal. The CVD growth process is then initiated to deposit a layer of single crystal diamond over the impurity layer to form the diamond boule. At desirable intervals, the CVD growth process is stopped and a surface of the diamond boule is polished in order to accept another impurity layer. Each impurity layer is photolithographically patterned in order to generate an alternating configuration of impurity regions and hole regions. The impurity regions and the hole regions enable the bond between the diamond layers to be weakened without causing the crystalline orientation to deviate. Once the diamond semiconductor boule is developed by this process, it can be easily sliced by a laser slicing process into a plurality of diamond semiconductor wafers along the impurity layers.

Growing community of inventors

Torrance, CA, United States of America

James C Lau