Agere Systems Inc.

Rosemount Aerospace Limited

James C Golden

Philip William Seitzer

Wayne Rademacher

Steven V Stang

Calvin Lee Schumacher

Marcus Allen Childress

Nghia T Dinh

A microstructure device package includes a package housing configured and adapted to house a microstructure device. A bracket is housed in the package housing. The bracket includes a bracket base with a first bracket arm and a second bracket arm each extending from the bracket base. A channel is defined between the first and second bracket arms. The first bracket aim defines a first mounting surface facing inward with respect to the channel. The second bracket aim defines a second mounting surface facing outward with respect to the channel. The second mounting surface of the bracket is mounted to the package housing. A microstructure device is mounted to the first mounting surface in the channel. The bracket is configured and adapted to isolate the microstructure device from packaging stress imparted from the package housing on the second mounting surface of the bracket.

Die attach stress isolation

A method of electrical testing devices such as integrated circuits that include conductive pads formed on the surface. A material having a desired bulk resistivity and viscosity is applied to either the device or the electrical probe prior to testing. The application of the material has been found to substantially reduce the need for cleaning of the probe.

Method of electrical testing of an integrated circuit with an electrical probe

Method of electrical testing

Growing community of inventors

Afton, MN, United States of America

James C Golden