Pseudolithic, Inc.

James Buckwaiter

Michael D Hodge

Daniel Somerset Green

Florian Herrault

Justin Kim

An electronic assembly has a host wafer having a first circuit including wafer transistors and passive, non-transistor devices. Chiplets have a second circuit including at least one radio frequency (RF) transistor device. Electrical interconnects are between the chiplets and wafer. The electrical interconnects electrically connect the first circuit to the second circuits. Oscillators that have the wafer transistor, the RF transistor and the electrical interconnects produce a signal for built-in self-test circuits for testing an assembly design of the electronic assembly and speeds of the RF chiplet transistors.

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Santa Barbara, CA, United States of America

James Buckwaiter