Oracle America, Inc.

Oracle International Corporation

James Britton

Jorge Eduardo Martinez-Vargas, Jr

Aleksey M Urmanov

Anton A Bougaev

Samuel Ming Sien Lee

Martin John Henson

Lien-Fen (Livia) Hu

A sensor board includes at least one sensor in communication with a controller having a single board address to facilitate sensor polling by standard, product-independent modules of a circuit board for a computer server or network appliance. Miniature low-cost sensor boards can be placed in multiple locations on circuit boards without the necessity of being specified and integrated into the circuit board during the design phase to reduce or eliminate associated design risks or delays.

System and method for monitoring computer servers and network appliances

Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or 'rib reinforcements') are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.

Rib reinforcement of plated thru-holes

Apparatuses and methods that provide for enhanced connections between PTHs of multi-layer PCBs and electronic component leads, pins or the like, are described herein. The apparatuses and methods improve the likelihood that the PTHs are completely filled with solder thereby advantageously allowing the PCBs to exhibit high mechanical and electrical reliability. Complete filling of PTHs is achieved by configuring the electrically conductive layers within the multi-layer PCB stack in a manner that reduces the heat sinking effects of the layers during the soldering process. In this regard, the PTHs may not directly contact all of the internal ground or power planes, so the heat sinking or heat transfer effects are reduced. This feature enables molten solder to substantially or completely fill an entire PTH before freezing.

Optimizing PCB power and ground connections for lead free solder processes

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El Paso, TX, United States of America

James Britton