Imra America, Inc.

Newport Corporation

Aradigm Corporation

James Bovatsek

Alan Y Arai

Rajesh S Patel

Fumiyo Yoshino

Donald J Harter

Lawrence Shah

Tadashi Yamamoto

Jeffrey A Schuster

Gyu Cheon Cho

Jingzhou Xu

Haibin Zhang

Rajesh D Patel

Russell M Pon

Makoto Yoshida

Geoffrey K McKinley

Sze-The Young

The present application is directed to a method and apparatus for processing a transparent or semitransparent material with a laser beam resulting in deterministic separation of a single sheet of the material into two or more pieces.

Method and apparatus for laser cutting transparent and semitransparent substrates

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

Transparent material processing with an ultrashort pulse laser

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

Femtosecond laser processing system with process parameters controls and feedback

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

Methods and systems for ultrashort pulse laser processing of optically transparent materials are disclosed. At least one embodiment includes a method for welding materials with ultrashort laser pulses to create a bond through localized heating, at least one material being transparent at a laser wavelength. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating sufficiently high fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. In various implementations the laser is focused near the sub-surface interface between two materials, generating high fluence at the region proximate to the laser focus with minimal modification to the surrounding region, including areas above and below the laser beam waist.

Methods and systems for laser welding transparent materials with an ultrashort pulsed laser

Femtosecond laser processing system with process parameters, controls and feedback

A method of forming a through-hole which is counter-tapered relative to a drilling laser involves directing, along an incidence axis and onto an impingement location on a first surface of a material, a laser beam of sufficient energy to ablate the material, the incidence axis being offset from a normal to the first surface at the impingement location. The material and the laser beam are then relatively rotated, for at least 360&deg;, such that a through-hole having a larger exit opening than entrance opening is formed.

Method for laser drilling a counter-tapered through-hole in a material

A method for inspecting small holes in a material is disclosed. The method comprises directing a light source through the holes in the material, and then focusing the light passing through the material onto a CCD detector. The focusing techniques allow for a reduction in the size of the image which must be inspected, thereby increasing sample throughput, while still allowing for detailed inspection of the hole number and quality. Methods of producing an aerosolization container and device comprising membranes which pass such an inspection are also provided.

Growing community of inventors

San Jose, CA, United States of America

James Bovatsek