Stryker Corporation

James Bernard Dunlop

John J Janik

Edward Chia-Ning Tang

Robert A Brindley

Leland Joseph Spangler

Rob Brindley

Joseph Leland Spangler

An implantable electrode array is provided that includes a carrier that is flexible. At least one control module is coupled to the carrier. A shell encases the control module. At least one electrode is coupled to the carrier and is electrically connected to the control module.

Implantable electrode array assembly including a carrier with packaged control modules

An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

Implantable electrode array assembly with an array substrate, electrodes and packaged integrated circuits

Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates

A method of forming an implantable electrode array that includes one or more packaged control modules. A control module is packaged by mounting the module to a substrate and forming a containment ring around the module. A conformal coating is disposed over the surface of the module to cover the carrier. Within the containment ring, the conformal coating hardens to form a non-porous shell around the control module. The one or more packaged control modules are placed in a flexible array. Electrodes that are mounted to or embedded in the flexible carrier are connected to the one or more control modules.

Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates

An implantable electrode array that includes a carrier on which multiple spaced apart electrodes are disposed. Embedded in the module are control modules. The control modules are contained in packages. Portions of the packages extend outwardly from the carrier so as to be disposed against adjacent surfaces of the carrier. The packages contain conductive tracts that provide conductive links from the conductors internal to the carrier to the packaged control modules.

Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier

An implantable electrode array () that includes multiple spaced apart electrodes () to which current can be individually sourced and sunk. The array includes a carrier () that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows () within the carrier.

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Colorado Springs, CO, United States of America

James Bernard Dunlop