Credo Technology Group Limited

James Bartenslager

Haoli Qian

Junqing Phil Sun

Arshan Aga

A method of assessing the ability of one or more multi-die circuit elements to tolerate the presence of jitter in intra-package. The method includes: providing a first die having a set of transmitters for digital communications, the set of transmitters comprising a first transmitter and a second transmitter; providing a second die having a set of receivers for digital communications; providing a performance monitor; coupling, using an intra-package trace, a first transmit signal from the first transmitter to a receiver of the set of receivers; coupling a second transmit signal from the second transmitter to an external pin; supplying an input signal that induces jitter in the first and second transmit signals; measuring jitter in the second transmit signal via the external pin; and determining, using the performance monitor, a performance characteristic of the second die.

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San Jose, CA, United States of America

James Bartenslager