Oracle International Corporation

Oracle America, Inc.

Sun Microsystems, Inc.

James Ballard

Kiran Kishore Vedantam

Yi Wu

Mini Nanua

Salvatore Caruso

Mark O'Brien

Robert Paul Masleid

Aparna Ramachandran

Kenan Yu

Miao Rao

Sampanna Prashant Pathak

Guneet Singh

Hsiangwen Lin

Wanyun Singh

Mark Russell O'brien

A method may include obtaining a design including cells and a power grid. The method may further include dividing the design into tiles, determining a voltage budget for a tile, calculating a voltage drop for each cell of the tile based on determining an activity factor for the cell and a peak current consumed by the cell, determining, for each cell of the tile and based on the power grid, an affected vicinity for the cell including one or more neighboring cells affected by a current drawn on the cell, determining an affected vicinity for the tile based on the affected vicinity for each cell of the subset, calculating a voltage drop for the tile based on the voltage drop for each cell of the affected vicinity for the tile, and detecting a voltage deviation when a difference between the voltage budget and the voltage drop exceeds a threshold.

Adaptive power grid generation

Systems, methods, and other embodiments associated with mitigating wire capacitance are described. In one embodiment, a method includes loading, by at least a processor into an electronic memory, an electronic data structure that includes a design of an integrated circuit. The design defines layers of the integrated circuit and connections between structures and wire interconnects in the layers. The example method may also include generating, by at least the processor, a structured topology in the design by successively routing the wire interconnects throughout the layers according to coordinates of the structures in the design and weighted values associated with each of the structures to mitigate wire capacitance of the wire interconnects.

Mitigating wire capacitance in an integrated circuit

Systems, methods, and other embodiments associated with an integrated circuit that includes a plurality of parallel pillar structures is described. In one embodiment, an integrated circuit includes a series of layers. The series of layers include a plurality of pillar metals in each of the series of layers. Pillars within each of the series of layers are oriented to be parallel. Pillars in adjacent layers are aligned to be perpendicular. Each of the plurality of pillar metals is a rectangular segment of metal. The plurality of pillar metals form a reconvergent mesh grid. The series of layers includes a plurality of vias connecting the plurality of parallel pillar metals between the series of layers. Vias of the plurality of vias are located at intersections in the reconvergent mesh grid.

Mitigating electromigration effects using parallel pillars

Systems, methods, and other embodiments associated with an integrated circuit that includes a plurality of parallel pillar structures is described. In one embodiment, a system includes a design logic configured to analyze a design of an integrated circuit to identify open tracks on each layer by determining a location of structures in each layer of the design. The open tracks are spaces on each layer of the design that are free from structures that obstruct routing the plurality of pillar metals. The system also includes routing logic configured to successively route the plurality of pillar metals in each of the layers of the design based, at least in part, on the parameters and the location of the structures. The routing logic routes pillars of the plurality of pillar metals that are in adjacent layers to be perpendicular and pillar metals that are within a same layer of the design to be parallel.

Methods and systems for flexible and repeatable pre-route generation are described. In one embodiment, a routing selection is received. The routing selection is for a path between at least a first cell and a second cell. The first and second cell are associated with a functional description of an integrated circuit. A floorplan associated with the functional description is modified to create a modified floorplan. The modified floorplan has a physical design change relative to the floorplan. A pre-route is automatically generated based on receipt of the routing selection and the modified floorplan. The pre-route is added to a physical design of the chip to create a pre-routed physical design. Additional methods and systems are disclosed.

Methods and systems for flexible and repeatable pre-route generation

A semiconductor die includes: a clock distribution network that distributes a clock signal within the die. The clock distribution network includes: a clock tree corresponding to one or more metal layers of the die, a plurality of clock spines corresponding to a metal layer of the die, a plurality of clock wings corresponding to a metal layer of the die, a plurality of clock grid drivers placed in one or more gaps of a floorplan corresponding to the semiconductor layer of the die, a clock grid placed in the one or more gaps of the floorplan, a plurality of buffers placed in a local gain buffer pair configuration wherein the local gain buffer pair connects the clock grid to a shorting bar, and a plurality of conductors that connect the shorting bar to a plurality of loads.

Low RC global clock distribution

A method of performing a pre-route repeater insertion methodology for at least part of a circuit design may include: partitioning at least part of a circuit design into a plurality of tiles; determining at least one attribute of one or more individual tiles of the plurality of tiles; and determining a repeater solution based at least in part on the determined attributes of the one or more individual tiles. A computer implemented tool for performing a pre-route repeater insertion methodology for at least part of a circuit design may include: a module configured to partition at least part of a circuit design into a plurality of tiles; a module configured to determine at least one attribute of one or more individual tiles of the plurality of tiles; and a module configured to determine a repeater solution based at least in part on the determined attributes of the one or more individual tiles.

Methods, computer-readable media and computer-implemented tools for pre-route repeater insertion

A mechanism is disclosed for determining pin assignments in an integrated circuit. More particularly, the mechanism involves accessing design information for the integrated circuit. The design information includes a floorplan that sets forth an arrangement of blocks in the integrated circuit and timing information for interconnections between the blocks. Based on the timing information, routing information is determined for the interconnections between the blocks. The routing information includes physical routes and physical pin placements for the interconnections.

Growing community of inventors

Palo Alto, CA, United States of America

James Ballard