Apple Inc.

Other

James B Smith

Scott A Myers

Matthew D Hill

Michael Benjamin Wittenberg

Ashutosh Yugesh Shukla

Benjamin Shane Bustle

Lucy Elizabeth Browning

Derek C Krass

Gregory N Stephens

David A Pakula

Daniel William Jarvis

Ian A Spraggs

Shayan Malek

Andrew U Leopold

Dale T Morgan

Marwan Rammah

Owen D Hale

Simon Christopher Helmore

Jason S Sloey

Nicholas George Merz

Rasamy Phouthavong

Eric N Nyland

Nicholas G L Merz

Boon Wai Shiu

Sina Bigdeli

Jonathan C Wilson

Bryan D Keen

Depeng Wang

Ethan R Stobbe

Cameron Bauer

Samuel J Pliska

Macey E Dade

Yifan Zhao

Gregory N Stevens

An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

Housing features of an electronic device

A mobile phone may include a housing, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing and positioned along a side of the battery. The circuit board assembly may include a first circuit board defining a first hole, a second circuit board defining a second hole, a wall structure between the first circuit board and the second circuit board and attached to an inner surface of the first circuit board and an inner surface of the second circuit board, and a fastener assembly configured to retain the first circuit board to the second circuit board.

Handheld electronic device

The disclosed technology relates to a dual board-to-board connector battery management circuit module utilizing a switch-back service loop for a battery pack. The management circuit module is coupled to a first and second terminal of a battery pack and includes a first board-to-board connector disposed proximal to a first end of the management circuit module; and a second board-to-board connector disposed proximal to a second end of the management circuit module. The second board-to-board connector is positioned opposite the first board-to-board connector.

Dual board-to-board connector battery management circuit module utilizing a switch-back service loop

Battery for an electronic device

A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components. The distributed auxiliary hub, when electrically coupled to an external resource, is capable of directly transmitting electrical current to electronic components.

Distributed auxiliary hub for a portable electronic device

An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.

Circuit board interposer

This application relates to a flexible cable for a portable electronic device, where the portable electronic device includes operational components having connectors that are capable of being electrically coupled to the flexible cable. The flexible cable includes a dielectric substrate having a generally planar shape, an upper grounding plane, a lower grounding plane, and a first signal transmission line that is separated by the upper and lower grounding planes, where the dielectric substrate is capable of electromagnetically shielding the first signal transmission line.

Space-efficient flex cable with improved signal integrity for a portable electronic device

Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

Component shielding structures with magnetic shielding

This application relates to methods and apparatus pertaining to a SIM tray that includes a deformable portion. When the SIM tray is subjected to stresses that result from tolerance stacking, the deformable portion accommodates the differences tolerance errors by allowing the non-deformable portion of the SIM tray to move substantially independently from one another. Creating the deformable portion can be accomplished by utilizing materials with lower relative moduli of elasticity, dovetails, magnets, or other means.

Cosmetically self-centering removable module tray

The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.

Flexible shock absorbing connections within a mobile computing device

Growing community of inventors

San Francisco, CA, United States of America

James B Smith