International Business Machines Corporation

James B Randolph

Conrad J Aug

Charles J Guenther

This circuit system accommodates the interconnection of a plurality of modules, each containing a plurality of semiconductor chips, by means of a flexible printed circuit wiring assembly containing contact pads and an interconnection wiring pattern. The modules contain a set of contact pads corresponding to the pads on the flexible wiring assembly and alignment pins to bring the abutting pads into registration. The pads on the flexible wiring assembly have a plurality of contact bumps to make better contact with the module packs. Clamping means is provided to retain the module and exert pressure on the contact pads.

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Rochester, MN, United States of America

James B Randolph