Rockwell Collins, Inc.

James B Mayfield

Jeffrey J Deloy

Tristan J Kendall

Robert D Pond

Daniel J Kaplan

Joshua Gerdes

Robert P Campbell

Steven C Stowe

Andre G Moorman

John A Bauer

A system including a power component that is configured to be removably couplable to a printed circuit board (PCB) assembly is disclosed. The power component may include a power sub-component coupled to a plurality of wire leads and a carrier. The carrier may include a body defining a recess configured to receive the power sub-component and support legs extending from the body. The power component may be elevated above PCB components by virtue of the support legs. The system may also include pins configured to be coupled to the plurality of wire leads and inserted through the attachment features and into receiving features (e.g., sockets) of the printed circuit board assembly to electrically couple the plurality of wire leads to the receiving features of the printed circuit board assembly.

Re-workable socketed space saving magnetics

A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.

Geometrically configurable planar wafers

A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

Through-hole and surface mount printed circuit card connections for improved power component soldering

A phased array system includes an antenna system includes multiple antennas configured to transmit or receive signals and a power supply circuit configured to generate a supply power and provide the supply power to a plurality of distributed power supply circuits. The phased array system includes distributed power supply circuits, each of the plurality of distributed power supply circuits configured to receive the supply power from the power supply circuit and generate radio frequency supply powers for one multiple radio frequency circuits. The phased array system includes radio frequency circuits, each of the radio frequency circuits configured to cause one of the antennas to transmit or receive the signals based on the plurality of radio frequency supply powers.

Distributed power supply system for phased arrays

A combined alternating current (AC) and direct current (DC) power converter is disclosed. In embodiments, the power converter includes an electromagnetic interference (EMI) filter, a bridge rectifier, and a boost converter. The EMI filter is configured to receive an electrical signal from a power source. The bridge rectifier is coupled to the EMI filter and includes at least four diodes arranged in a diode bridge configuration. The boost converter is coupled to the bridge rectifier and includes a switched DC path and a switched AC path. The switched DC path includes a DC transistor and the switched AC path includes an AC transistor. The switched AC path can also include one or more diodes and/or switching elements.

Growing community of inventors

Cedar Rapids, IA, United States of America

James B Mayfield