Microsoft Technology Licensing, LLC

James Anthony Fikse

Douglas Patrick Kelley

Martin Brokner Christiansen

Kathryn Midori Oseen-Senda

Matthew David Turner

Alexis Grace Schubert

Martin B Christiansen

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

Growing community of inventors

Bellevue, WA, United States of America

James Anthony Fikse