Motorola Corporation

Motorola Mobility LLC

James A Zollo

Nitin Desai

John K Arledge

Rudy Yorio

Barbara R Doutre

Ronald James Kelley

James L Tracy

Kenneth R Thompson

Henry F Liebman

Lonnie L Bernardoni

Stephen O Bozzone

Rami Chaim Levy

Alan R Beatty

John C Barron

Bonnie J Bachman

Gary R Burhance

John Holley

Nitin B Desai

A multilayer substrate assembly () includes at least one embedded component () within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (), patterned conductive surfaces (and) on opposing sides of the core dielectric, and at least one hole () in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole (). The assembly further includes a processed adhesive layer () between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap (&) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of pre-processed substrates.

Multilayer circuit board with embedded components and method of manufacture

A method and apparatus form electrical connections between electronic circuits and conductive threads () that are interwoven into textile material (). Electronic circuits (), such as semiconductor dies, are connected to a carrier () and electrical connections () are made to conductive connection areas () on the carrier (). Conductive stitching () provides electrical contacts for both the conductive connection areas () on the carrier () and the conductive threads () that are interwoven into the textile material (). Optionally, a thin, flexible substrate material () is perforated during the stitching process.

Method and apparatus for solder-less attachment of an electronic device to a textile circuit

A multilayer circuit board () includes a plurality of substrate cores (and), an adhesive/bonding layer () between at least two among the plurality of substrate cores, and a microvia (and) in each of at least two of the plurality of substrate cores. The microvia includes a conductive interconnection () between a top conductive surface and a bottom conductive surface of each of the plurality of substrate cores and the microvia in a first substrate core is arranged to be inverted relative to a microvia in a second substrate core. The multilayer circuit board can further include a plated through-hole () through the plurality of substrate cores and the adhesive/bonding layer such that at least two among the top conductive surfaces (or) and the bottom conductive surfaces (or) of the plurality of substrate cores are connected.

Inverted microvia structure and method of manufacture

A substrate assembly () and method of making same has at least one embedded component () in a via () of a substrate core () and includes a first adhesive layer () coupled to the substrate core, and a second adhesive layer () on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer () adhered to the bottom surface of the substrate core and a second conductive layer () on the second adhesive layer. The substrate assembly can further include an interconnection () between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening () that at least temporarily exposes at least a conductive surface () of the embedded component.

Circuit board with embedded components and method of manufacture

Methods and apparatus for adding additional circuitry ( ) to a circuit board ( ) having a radiation shield ( ) associated therewith include the additional circuitry ( ) mounted onto a flex circuit ( ) which in turn is mounted on the radiation shield ( ). A conductor ( ) containing portion ( ) of the flex circuit ( ) extends therefrom and is routed around and through a cutout ( ) in the bottom surface of the radiation shield ( ). The conductor ( ) is connected to the printed circuit board ( ) at the location of the cutout ( ) in the radiation shield ( ).

Augmented circuitry integration for a printed circuit board

An integrated circuit (106) having an optically erasable portion (114) is joined to a substrate (102) such that the optically erasable portion faces the substrate. The substrate (102) includes an aperture (104) that exposes the optically erasable portion (114) of the integrated circuit providing erasing capability to the integrated circuit (106). A plug (110) impermeable to light may be inserted into the aperture (104) to provide a sealed window to the optically erasable portion (114) of the integrated circuit (106).

Method and assembly for mounting an electronic device having an

Assembly for mounting an electronic device having an optically erasable

A stackable surface mount electronic component assembly 100 allowing for the stacking of electronic components 108, and 112 is disclosed. The stackable surface mount electronic component assembly 100 includes electronic component carriers 102, and 114, each having an electronic component 108, and 112 respectively. The two carriers 102, and 114, are electrically interconnected by the use of solder balls 106. Electronic component carrier 114 is in turn attached to an external printed circuit board by the use of solder balls 110. Optionally, each of the electronic components 108, 112 can be encapsulated using encapsulation material prior to the joining of the two carriers 102, and 114. In an alternate embodiment recesses 302 are located on top of the elevated peripheral edge 116 allowing for the proper alignment of the two carriers 102, and 114.

Electronic component assembly

Growing community of inventors

Weston, FL, United States of America

James A Zollo