Apple Inc.

Materion Gmbh

Boston Electrometallurgical Corporation

James A Yurko

Abhijeet Misra

Christopher D Prest

William A Counts

Herng-Jeng Jou

Hoishun Li

Brian M Gable

Edgar E Vidal

Nicholas W Hutchinson

Stephen Brian Lynch

John Raff

Albert John Golko

Dale N Memering

Christopher D Jones

Ibuki Kamei

David E Kingman

Phil M Hobson

Donald R Monroe

Derek C Scott

Eric W Hamann

Juan A Lazaro

Michael Benjamin Wittenberg

Lee E Hooton

Brian S Tryon

Zechariah D Feinberg

Todd S Mintz

Jeffrey Lee Mattlin

Isabel Yang

Lei Gao

Weiming Huang

Anthony D Prescenzi

Eric Steven Jol

Matthew S Rogers

Theodore Andrew Waniuk

Naoto Matsuyuki

Daniel C Wagman

James A Curran

Donald Robert Sadoway

Adam Thomas Clavelle

James A Wright

Richard Hung Dinh

Alexander W Williams

Hani Esmaeili

Nagarajan Kalyanasundaram

Manish Mittal

Lijie Bao

Brian P Demers

Wai Man Raymund Kwok

Yi Chun Chen

Robert W Hyers

Katie L Sassaman

Jeremy Li

Graeme W Paul

Nicholas W Hitchinson

Rafael Yu

Anuj Datta Roy

Susannah P Calvin

Jennifer D Schuler

Jing Zhou

Andrew W Meschke

A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

Additively manufactured device enclosures

A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to titanium surfaces. This process forms an oxide layer on a titanium surface that includes a layered double hydroxide. The layered double hydroxide both raises the bond strength and minimizes air or water leakage. The process enables the use of titanium alloys with injection molded polymer structural bonds in strong, lightweight, and water-resistant enclosures for consumer electronics.

Porous oxide for improved titanium-polymer bonding

A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

Core shell with various filler materials for enhanced thermal conductivity

A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.

Direct metal deposition of electronic device components

A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.

Surface treatment for metallic components

A method of making an article includes depositing a plurality of layers to form a three-dimensional preform, sintering the preform to form a sintered preform, and infiltrating the preform with at least one metal to form the article. At least one layer of the plurality of layers is formed from a beryllium-containing composition including beryllium powder. The infiltrating metal can be selected from aluminum and magnesium.

Additive manufacturing of articles comprising beryllium

An electronic device may have a housing. The device may include metal structures such as a metal member forming a portion of the housing, a portion of a strap, or other portions of the device. A gold-containing coating such as a layer of elemental gold or a gold alloy may cover the metal member to provide the metal member with a gold appearance or other desired appearance. To protect the metal member and the gold-containing coating, the metal member and gold-containing coating may be covered with a protective coating layer such as an organic protective layer. The organic protective layer may have a fluoropolymer layer with thiol coupling groups to promote adhesion to the gold-containing layer or may contain a polymer layer with silane and thiol coupling groups that serves as an adhesion promotion layer for an overlapping fluoropolymer layer with silane coupling groups.

Electronic devices with corrosion-resistant colored metal structures

A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

Nanotwin copper components

A glass fastening system includes a glass portion, a support structure defining a recess, a first adhesive layer disposed on an exterior surface of the glass portion facing the recess in the support structure, a second adhesive layer disposed within the recess of the support structure, and a fastener having a first portion secured to the first adhesive layer and a second portion extending away from the first portion and into the second adhesive layer to secure the glass portion to the support structure.

Glass fastening and sealing systems

A method of and system for electrolytic production of reactive metals is presented. The method includes providing a molten oxide electrolytic cell including a container, an anode, and a current collector and disposing a molten oxide electrolyte within the container and in ion conducting contact with the anode and the current collector. The electrolyte includes a mixture of at least one alkaline earth oxide and at least one rare earth oxide. The method also includes providing a metal oxide feedstock including at least one target metal species into the molten oxide electrolyte and applying a current between the anode and the current collector, thereby reducing the target metal species to form at least one molten target metal in the container.

Electrolytic production of reactive metals

The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

Recycled aluminum alloys from manufacturing scrap with cosmetic appeal

A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600&#xb0; C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

Mold materials for formed ceramic

A glass sealing system includes a glass portion and a first adhesive layer disposed along an exterior surface of the glass portion. The glass sealing system also includes a cover with a first surface secured to the first adhesive layer and a second surface opposing the first surface. The glass sealing system includes a second adhesive layer disposed on the second surface and configured to secure the cover to a support structure. The cover obscures the second adhesive layer from view of a user looking through the glass portion toward the support structure.

An electronic device such as a wristwatch may include a conductive housing. A corrosion-resistant coating may be deposited on the conductive housing. The coating may include transition layers and an uppermost alloy layer. The transition layers may include a chromium seed layer on the conductive housing and a chromium nitride layer on the chromium seed layer. The uppermost alloy layer may include TiCrCN or other alloys and may provide the coating with desired optical reflection and absorption characteristics. The transition layers may include a minimal number of coating defects, thereby eliminating potential sites at which visible defects could form when exposed to salt water. This may allow the electronic device to exhibit a desired color and to be submerged in salt water without producing undesirable visible defects on the conductive housing structures.

Electronic devices having corrosion-resistant coatings

A counter gravity casting apparatus includes a reusable metal mold having a plurality of mold cavities, a feed tube configured to feed molten alloy into the mold, and a vacuum fitting configured to permit a vacuum to be applied to the mold. The mold includes multiple metal sections configured such that adjacent metal sections mate to one another, the metal sections being separable from one another. The metal sections include recesses that form the mold cavities, and the mold includes a sprue and multiple runner passages. The sprue is configured to receive molten alloy from the feed tube, and the multiple runner passages are configured to feed molten alloy from the sprue to the mold cavities. Methods of casting bulk amorphous alloy articles or feedstock is described.

Systems and methods for counter gravity casting for bulk amorphous alloys

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Saratoga, CA, United States of America

James A Yurko