Indium Corporation of America

Advanced Technology Materials, Inc.

James A Slattery

Charles E White

John R Sovinsky

August F Witt

Frank W Gayle

George E Kraeger

Michael F McNamara

A high lead solder exhibiting improved wettability to metal substrates, an advantageously controlled melting range, and excellent thermal fatigue properties. It comprises about 98-100% lead and a minor amount, typically about 0.0005-0.1 wt %, based on the total weight of the solder composition, of an alkali metal selected from the group consisting of Na, K, and Li. Additional embodiments additionally comprise an amount of a grain-size controlling additive, e.g., 0.001-0.5 wt % (based on the total weight of all the components in the solder composition) selected from the group consisting of Ce, Ba, La, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Y, Lu, Sc, Mg, Na, Se, Te, oxides thereof and mixtures thereof, in amount effective to control the Pb grain size; and 0-1 wt % of an element selected from the group consisting of Sn, In, Bi, Sb, Ag, Au, and Ga, and mixtures thereof.

Lead-based solders for high temperature applications

A low melting point solder alloy comprising effective amounts of tin, silver and indium.

Lead-free alloy containing tin, silver and indium

A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.

Lead-free alloy containing tin, zinc, indium and bismuth

An alloy composition comprising effective amounts of bismuth, indium, lead, tin, and gallium, which is especially suited for lens blocking.

Fusible alloy containing bismuth, indium, lead, tin and gallium

A method and apparatus for ultrapurification of indium and other metals having a wide liquid range and low vapor pressure. The purification method involves producing a small-diameter stream of liquified metal, directing this stream along a predetermined path while subjecting it to a high vacuum and heating it to vaporize volatile impurities, then collecting and solidifying the purified stream. The method is optimally practiced in the ultrahigh vacuum and substantially zero gravity environment of outer space. Apparatus for practicing the method in outer space employs a containerless refining zone in which the stream of liquid metal being purified is directed along a path defined by edges of thin guides fabricated of material which is not substantially wetted by the liquid metal. Heating of the liquid metal stream is accomplished via RF coils surrounding the guides defining the stream path. Upon collection, the purified metal stream may be further subjected to a secondary refining process. Earth-based embodiments of the method and apparatus are also disclosed.

Process for ultrapurification of indium

A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.

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Sauquoit, NY, United States of America

James A Slattery