Harris Corporation

James A Sanborn

Ralph D DiStefano

Janet D Sadlon

Gary A Rief

Marc H Popek

Bobby J Boan

Steven E Wilson

Robert J Guinn, Jr

Talmadge H Callahan

Decosta R Alewine

Greg Jandzio

Joseph W Priester

A method of making a thin, lightweight and flexible RF waffleline includes the production of a negative silicone casting from a relatively thick and rigid metal positive tooling plate having the identical matrix of the desired waffleline and product. The waffleline is formed by casting an epoxy resin on the silicone casting or nickel electroforming, following by metallization. The waffleline end products is either a very thin and flexible epoxy composite structure or a nickel electroform metallized with gold. Accordingly, a negative WMA image can now be cast, as opposed to expensive machining or forming, with relatively simple and inexpensive techniques in fabricating the process tooling.

Lightweight, flexible waffleline interconnect structure and methods of

Materials having diverse coefficients of thermal expansion are joined together by means of an adhesive film, electrically insulative mesh structure that cures at room temperature. An adhesive film bonding technique is employed to mount a printed wiring board, having a relatively low coefficient of thermal expansion, to a thermally and electrically conductive aluminum stiffener having a relatively high coefficient of thermal expansion, while maintaining the printed wiring board electrically insulated from the aluminum stiffener. A non-adhesive plastic `release` film is initially attached to a flat support substrate. A layer of electrically insulative mesh (glass cloth) is taped onto the plastic release film. The glass cloth is then impregnated with an electrically insulative adhesive that cures at room temperature. The aluminum stiffener is then placed on the adhesive-impregnated cloth layer, which is then cut to fit, using the aluminum stiffener as a template. The release polyester film and the flat support substrate are removed, exposing the opposite side of the adhesive-impregnated cloth layer for attachment to the printed wiring board. The resulting laminate assembly of the printed wiring board, the adhesive-impregnated glass cloth, and the aluminum stiffener plate is placed in a vacuum bag and allowed to cure at room temperature. Because the laminate cures at room temperature, the physical configuration of the assembly will not have changed at cure.

Joining of printed wiring board to aluminum stiffener using adhesive

A process for forming a stripline interface conductor. A stripline interface conductor receives a circuit element and provides spaced-apart connections to each of the closely spaced leads of the circuit element. A first ground plane layer and an attached dielectric layer are perforated to create a first access opening and a plurality of second access openings. The plurality of second access openings are spaced at a distance from the first access opening so that closely spaced leads of the circuit element can be attached to signal traces at the first access opening and electrical connection can be made to the leads in a spaced-apart geometry at the plurality of smaller access openings. A second dielectric layer including top and bottom metallic layers is attached to the exposed side of the first dielectric layer. Before this attachment the top metallic surface of the second dielectric is etched to form the signal traces and a third access opening is formed through all three layers. The two pieces are bonded using a liquid adhesive and the first access opening is placed in registry with the third access opening. The circuit element is electrically connected to the signal traces using the portion of the signal traces exposed through the registered holes. Spaced apart connections to the leads of the circuit element are provided through the plurality of spaced-apart second access openings.

Process for fabricating a sculptured stripling interface conductor

An electrically conductive epoxy-based adhesive. The epoxy is selected from the amine curing modified epoxy family consisting of a resin that is a combination of polygylcidylaminophenyl resin and polygylcidylether of phenylformaldehyde novalac resin family and a catalyst that is a combination of one member from the aliphatic amide family plus one member from the aliphatic polyamine family. In one embodiment includes 17 parts by weight of the resin and 10 parts by weight of the catalyst. 73 parts by weight of a mixture of properly shaped silver flake particles are added. The resulting adhesive is curable at room temperature to provide a high-temperature, high-strength, electrically conductive adhesive.

Electroconductive adhesive

Growing community of inventors

Satellite Beach, FL, United States of America

James A Sanborn