Raytheon Company

James A Robbins

Angelo M Puzella

John B Francis

Donald A Bozza

Christopher M Laighton

William J Davis

Patricia S Dupuis

Robert B Hallock

Kenneth S Komisarek

Kassam K Bellahrossi

Philip M Henault

Jeffrey A Shubrooks

Jonathan B Langille

Craig C Lemmler

A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.

Device and method for reworking flip chip components

A power amplifier structure having: a power divider for dividing power in a signal fed to an input port between a pair of output ports. Each one of a pair of amplifiers has: an input coupled to a corresponding one of the pair of power divider output ports; and an output. A power combiner is provided. Signals at the power divider output ports are fed to the inputs of the pair of amplifiers in a forward direction and then pass through the amplifiers in the forward direction towards the outputs of the pair of amplifiers. Connectors direct the signals at the amplifier outputs to the power combiners, the signal then passing through the power combiner to an output port in a direction opposite to the forward direction.

Compact microwave power amplifier circuit

A turnstile antenna element and balun for use in a phased array are described. The antenna includes a plurality of stacked bowtie radiators. Each stacked bowtie radiator includes a driven conductor and a passive conductor separated by a dielectric. The balun includes a central member having dielectric slabs symmetrically disposed on external surfaces thereof. At least one end of the balun is provided having a shape such that conductors on the dielectric slabs of the balun can be coupled to the driven radiator conductors.

Stacked bowtie radiator with integrated balun

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

Transmit/receive daughter card with integral circulator

In one aspect, an active electronically scanned array (AESA) card includes a printed wiring board (PWB) that includes a first set of metal layers used to provide RF signal distribution, a second set of metal layers used to provide digital logical distribution, a third set of metal layers used to provide power distribution and a fourth set of metal layers used to provide RF signal distribution. The PWB comprises at least one transmit/receive (T/R) channel used in an AESA.

Active electronically scanned array (AESA) card

A MMIC flip chip mounted to a circuit board having an underfill material disposed between the MMIC and the circuit board and a barrier structure for preventing the underfill material from being disposed under an electronic device of the MMIC while providing a cavity under the electronic device.

Growing community of inventors

Groton, MA, United States of America

James A Robbins