Raychem Limited

Other

Tyco Electronics Corporation

Elo Touchsystems, Inc.

James A Rinde

George Pieslak

Barry C Mathews

Leon C Glover

Miguel A Morales

George B Park

Robert P Saltman

Neville S Batliwalla

Edward F Chu

Stephen Michael Baigrie

Vijay N Reddy

Norman A Gac

Tony G Alvernaz

Len Barrett

Robin John

Eric Van Zele

Joel Christopher Kent

John Seymour Mattis

Paul Becker

Frank W Mercer

Eugene F Lopez

Keith Dawes

Jeff Dolin

Cecilia A Walsh

Mark W Ellsworth

Frank Wasilewski

Orion Jankowski

Drew John Loucks

Mark W Ellsowrth

Rudolf R Bukownik

Richard M Rowe

An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness R and a reflection density RD, the product R times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer, and electrical devices using an adhesion promoting layer in combination with a crosslinking agent are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.

Electrical devices containing conductive polymers

A curable polymeric composition which is a liquid at 20&deg; C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65% by weight of an inert inorganic filler. The curable composition can be used in a method of protecting a substrate such as a pipe or a pipe joint from corrosion or mechanical damage. In the method, the curable composition is first applied to the substrate, a polymeric covering layer is applied over the curable composition with an innermost layer of a heat-activatable sealant in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.

Curable polymeric composition and use in protecting a substrate

A sealing system for an acoustic touchscreen includes an elongate gel body between the touchscreen and the bezel of a housing onto which the touchscreen is mounted. The elongate gel body forms a seal around the perimeter of the touch-sensitive area of the touchscreen. A stop element controls and limits the amount of compression of the elongate gel body. The resulting seal is highly effective in protecting the unexposed parts of the touchscreen (i.e., areas other than the touch-sensitive area) from contaminants, especially liquid contaminants, at the cost of an acceptably low loss in acoustic signal strength.

Sealing system for acoustic wave touchscreens

A gel material is expanded by first subjecting mixture of a gel precursor material and heat-expandable microspheres to a curing regimen which cures the precursor material into a gel material without expanding the microspheres and then heating to expand the gel material containing the microspheres. In this manner, an intermediate product in the form of a gel which is more handleable than the typically syrupy precursor material is produced. This intermediate product can be manipulated and placed at the intended application location and then expanded.

Method of expanding a gel material

A curable polymeric composition which is a liquid at 20&deg; C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65% by weight of an inert inorganic filler. The curable composition can be used in a method of protecting a substrate such as a pipe or a pipe joint from corrosion or mechanical damage. In the method, the curable composition is first applied to the substrate, polymeric covering layer is applied over the curable composition with an innermost layer of a heat-activatable sealant in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.

Method of applying protective covering to a substrate

A touch sensor system, including a substrate, capable of propagating surface acoustic waves; and a reflective array formed on said substrate, said reflective array having a plurality of reflective elements, each reflective element reflecting a portion of an incident surface acoustic wave. The reflective array is formed of an organic matrix. The organic matrix is preferably chemically bonded to the substrate, and is preferably a thermoset resin. The resulting reflective arrays are preferably stable under changes in moisture between 0% and 60% RH at temperatures between about 0.degree.-50.degree. C. The organic matrix can also be used in a humidity or chemical sensor.

Organic matrix for acoustic reflector array

A substrate (12,14) is enclosed with a heat recoverable backing with a layer of a thermosetting adhesive composition (20) comprising an amorphous thermoplastic resin and a thermosetting resin positioned between the heat recoverable article (10, 26) and the substrate (12,14). The adhesive composition can be in the form of a self supporting sheet or tape or it can be on a surface of the heat recoverable article (10). In some embodiments, a polymeric insert (32) is also used to ensure adequate sealing between the substrate and the thermosetting adhesive.

Enclosing a substrate with a heat-recoverable article

A conductive polymer composition in which a particulate conductive filler is dispsered in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

Conductive polymer composition

A conductive polymer composition in which a particulate conductive filler is dispersed in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.

Crosslinkable gel compositions cure rapidly to provide gel compositions which possess superior combinations of chemical and physical properties and aging resistance. These compositions are particularly useful for environmentally protecting substrates, especially electrical conductors, connectors, and splices and for sealing around jacketed cables, for example where they enter splice cases.

Polyurea gel compositions and articles therefrom

The invention relates to a method for applying a protective coating to a substrate, such as metallic pipe, which comprises applying onto the substrate a liquid curable polymeric composition capable of curing to a substantial extent within about 24 hours at less than about 80.degree. C., then applying one or more polymeric layers, the innermost of which is capable of interacting with said curable composition, and permitting the composition to cure. In certain embodiments the polymeric layer is applied as a polymeric article, in other embodiments a multiple layer polymeric covering is applied over the curable composition.

Elongated substrate with polymer layer covering

Curable compositions which are useful for encapsulating electrical connections and for joining metals to metals, and which comprise a mixture of high and low molecular weight fluorocarbon elastomers. Preferred compositions comprise a mixture of three fluorocarbon elastomers, the first having a Mooney viscosity at 121.degree. C. of at least 120, the second a Mooney viscosity at 121.degree. C. of 80 to 110, and the third a Brookfield viscosity at 100.degree. C. of 1,000 to 4,000 centipoises, in amounts 5 to 50%, 25 to 70% and 5 to 50% respectively, based on the weight of the polymeric component. The compositions can be easily molded under heat and pressure, and after they have been cured, they have remarkable resistance to degradation by hot liquids, even under pressure. Consequently, the compositions are very useful in the manufacture of self-regulating heaters for use in heating the production tubes of oil wells.

Method of covering an electrical connection or cable with a

Protecting elongated substrate with multiple-layer polymer covering

Novel curable adhesives are solid, substantially free of cross-linking and substantially tack-free at 25.degree. C.; remain substantially uncured when maintained for extended periods at 80.degree. C.; have an initial viscosity of 10.sup.3 to 10.sup.4 poise at 150.degree. C. and cure relatively slowly at 150.degree. C.; and cure rapidly at 200.degree. C. The adhesives preferably contain at least one epoxy resin, particularly an epoxy resin having a softening point of at least 50.degree. C. and an epoxy equivalent weight of at least 200 in combination with an epoxy resin which is liquid at 25.degree. C. or an elastomer or other compatible high molecular weight polymer. The adhesive preferably also contains a high temperature curing agent and preferably also a filler, which may be particulate or fibrous. The novel adhesives are particularly useful in combination with heat-recoverable devices, e.g. devices comprising components made of heat-recoverable metal.

Growing community of inventors

Fremont, CA, United States of America

James A Rinde