Emc Corporation

James A Rice

Nader G Dariavach

A system is capable of making a metallic product with robust mechanical and electrical properties. The system includes a pressing stage configured to compress powder (e.g., MMC material) to form a green compact from the powder, a sintering stage configured to sinter the green compact to form a sintered structure from the green compact, and a consolidation stage configured to apply electric current to the sintered structure to form the metallic product from the sintered structure. The electric current is in the form of high density, short electric AC or DC pulses and results in consolidation of the sintered structure at grain boundaries to correct defects in the boundaries (e.g., areas of high electrical resistance) without melting the bulk metal to produce the metallic product. Such a system alleviates the need for coining process, which could fracture bonds and thus weaken the structure, following the sintering process.

Techniques for making a metallic product utilizing electric current in a consolidation process

A technique for manufacturing a product involves receiving material, providing plastic deformation to the material to at least partially form the product, and applying electric current to the material while providing the plastic deformation to the material. The electric current is configured to reduce flow stresses within the material during plastic deformation. In some arrangements, the electric current is a series of high-density, short electric pulses which increases plasticity due to increasing the dislocation mobility of the deformed material. In some arrangements, the electric current provides an electric current density through the material of at least 1000 Amperes per square millimeter with each electric pulse lasting no longer than 0.01 seconds.

Techniques for manufacturing a product using electric current during plastic deformation of material

A system is configured to treat a conductive component. The system includes a power source, an interface configured to electrically contact with a surface of the conductive component, and a controller coupled to the power source and the interface. The controller is configured to pass electric current (e.g., electric pulses) from the power source through the interface and the component to melt tips of a set of cracks along the surface of the component. As the current passes around the set of cracks, the current generates localized heating in high-resistance dislocations at the crack tips to repair the cracks. Accordingly, such current heals the cracks and inhibits the cracks from spreading. Furthermore, the effect of the current remains localized thus enabling the current to strengthen the material around the cracks while easily avoiding damaging or weakening other portions of the component.

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Waukesha, WI, United States of America

James A Rice