Silicon Light Machines Corporation

Cypress Semiconductor Corporation

Other

Screen Holdings Co., Ltd.

James A Hunter

Alexander P Payne

Christopher S Gudeman

Lars Eng

David T Amm

David Thomas Amm

Stephen Hamann

Gregory Beach

Krishnaswamy Ramkumar

Olav Solgaard

Tianbo Liu

Jahja I Trisnadi

Dinesh Maheshwari

Omar Sze Leung

Bryan P Staker

James E Nulty

Mira Ben-Tzur

Thurman John Rodgers

Mike Bruner

Wilhelmus Adrianus De Groot

Brent D Lunceford

Michael W Bruner

Richard Yeh

Clinton Carroll

Joshua Lu

Kenichi Sano

Alexander J Herrera

Clinton Carlisle

Alain Paul Blosse

Akira Tomita

Michael J Daneman

Michael J Dueweke

Charles B Roxlo

Josef Berger

Jahia Trisnadi

Yuki Ashida

Gregory Jacob

Zarem Harold

Klyoko Keuchi

Klyoko Ikeuchi

Toshio Hiroe

Microelectromechanical systems based spatial light modulators (SLMs), and display systems and methods for operating the same are described. Generally, the SLM includes a linear array of a number of electrostatically deflectable ribbons suspended over a surface of a substrate. Each ribbon includes a split-ribbon portion with a plurality of diffractors, each diffractor including a first light reflective surface on a linear portion of the split-ribbon portion and an opening through which a second light reflective surface affixed to the substrate is exposed. The first light reflective surface and the second light reflective surface have equal areas, and when one or more of the ribbons is deflected towards the surface of the substrate a coherent light reflected from the first light reflective surface is brought into constructive or destructive interference with light reflected from the second light reflective surface. The display system can include a projector or a head mounted unit.

High contrast spatial light modulator

A high-contrast two-dimensional Micro-Electromechanical System light modulator and methods of fabricating and operating the same in various applications is provided. Generally, the light modulator includes a single, deformable membrane suspended over a surface of a substrate by posts at corners thereof, the deformable membrane including an electrostatically deflectable patterned central portion (CP) and a number of flexures through which the CP is coupled to the posts. A membrane reflector is formed on a surface of the CP, and a substrate reflector over a surface of the substrate, and the substrate reflector exposed through void spaces between the posts, flexures and CP. The light modulator is operable so that when the membrane reflector is deformed into a non-planar surface by electrostatic deflection of the CP, and light reflected from the membrane reflector is brought into phase interference with light reflected from the substrate reflector.

Reflective two-dimensional spatial light modulators

An optical scanner including micro-electromechanical system phased-arrays suitable for use in a LiDAR system, and methods of operating the same are described. Generally, the scanner includes an optical transmitter having first phased-arrays to receive light from a light source, form a swath of illumination in a far field scene and to modulate phases of the light to sweep or steer the swath over the scene in two-dimensions (2D). An optical receiver in the scanner includes second phased-arrays to receive light from the far field scene and direct at least some of the light onto a detector. The second phased-arrays are configured to de-scan the received light by directing light reflected from the far field scene onto the detector while rejecting background light. In one embodiment the second phased-arrays direct light from a slice of the far field scene onto a 1D detector array.

MEMs phased-array for LiDAR applications

An optical system including a dual-layer microelectromechanical systems (MEMS) device, and methods of fabricating and operating the same are disclosed. Generally, the MEMS device includes a substrate having an upper surface; a top modulating layer including a number of light modulating micro-ribbons, each micro-ribbon supported above and separated from the upper surface of the substrate by spring structures in at least one lower actuating layer; and a mechanism for moving one or more of the micro-ribbons relative to the upper surface and/or each other. The spring structures are operable to enable the light modulating micro-ribbons to move continuously and vertically relative to the upper surface of the substrate while maintaining the micro-ribbons substantially parallel to one another and the upper surface of the substrate. The micro-ribbons can be reflective, transmissive, partially reflective/transmissive, and the device is operable to modulate a phase and/or amplitude of light incident thereon.

Dual-layer micro-ribbon MEMS light modulator

Spatial light modulators (SLMs) and systems using same are described. Generally, the system includes a laser, a fixture holding a workpiece to be processed using the laser, illumination optics to illuminate the SLM with laser light, imaging optics to focus modulated light from the SLM onto the workpiece, and a controller to control the laser, the SLM, imaging optics and the fixture to scan the modulated light across a workpiece surface. The SLM includes an array of microelectromechanical system based diffractors, each including an electrostatically deflectable member coupled to a first light reflective surface and to bring light reflected from the first light reflective surface into interference with light reflected from a second light reflective surface in the SLM. The controller is operable to provide analog gray-scale control of an intensity of modulated light reflected from each diffractor by controlling an electrostatic force generated by a driver coupled thereto.

MEMS based spatial light modulators and applications

A capacitive micro-electromechanical system (MEMS) structure or device and methods of making and operating the same are described. Generally, the MEMS device provides a large stroke while maintaining good damping, enabling fast beam steering and large scan angles. In one embodiment, the capacitive MEMS device includes a bottom electrode formed over a substrate; an electrically permeable damping structure formed over the bottom electrode, the electrically permeable damping structure including a first air-gap and a dielectric layer suspended above and separated from the bottom electrode by the first air-gap; and a plurality of movable members suspended above the damping structure and separated therefrom by a second air-gap, each of the plurality of movable members including a top electrode and being configured to deflect towards the bottom electrode by electrostatic force. Other embodiments are also described.

Spatial light modulators for phased-array applications

A spatial light modulator (SLM) including a two-dimensional (2D) array of n rows of m pixels, and a stacked drive circuit including at least one, one-dimensional (1D) array of n*m drivers monolithically integrated on the same substrate and methods of fabricating and methods of using the same in materials processing applications are provided. Generally, each pixel includes at least one modulator, and is configured to modulate light incident thereon in response to drive signals received from the stacked drive circuit. The 1D array of the stacked drive circuit includes a single row of n*m drivers arranged adjacent to and laterally separated from the 2D array of pixels. Other embodiments are also described.

Stacked PLV driver architecture for a microelectromechanical system spatial light modulator

A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS, wherein the package includes features that promote laminar flow of the fluid across the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.

Flow through MEMS package

Megasonic cleaning systems and methods of fabricating and using the same are provided. In one embodiment, the system comprises a plurality of Micro-Electromechanical System (MEMS) transducers, each transducer including a movable membrane with a membrane electrode coupled to a first potential disposed above and spaced apart from an upper surface of a die including a cavity electrode coupled to a second potential, the membrane including multiple layers including a polysilicon layer between a top silicon nitride layer and a bottom silicon nitride layer, and the membrane electrode includes the polysilicon layer; a chuck on which a target workpiece is positioned; and a fluid to couple sonic energy from the plurality of MEMS transducers to the target workpiece. Other embodiments are also provided.

Microelectromechanical system megasonic transducer

A system including spatial light modulators with multiple one-dimensional (1D) diffractor arrays and methods of operating the same are provided. In one embodiment, the system comprises a spatial light modulator (SLM) assembly including a plurality of one-dimensional (1D) diffractor arrays to modulate light from a light source, the plurality of 1D diffractor arrays integrally formed on a die; illumination optics disposed in a light path between the plurality of 1D diffractor arrays and the light source to illuminate a substantially linear portion of at least one of the plurality of 1D diffractor arrays; and imaging optics disposed in a light path between the SLM assembly and an image plane on a target-substrate, the imaging optics adapted to transmit modulated light from the SLM assembly to a substantially linear portion of the image plane. Other embodiments are also provided.

Spatial light modulator with multiple linear arrays

A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS. In certain embodiments, the fluid includes an gas, such as nitrogen, and the inlet and outlet are adapted to provide a flow of gas of from 0.01 Standard Cubic Centimeters per Minute (sccm) to 10000 sccm during operation of the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.

A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Method of fabricating an integrated device

A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

A probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.

Method of fabricating a probe card

Growing community of inventors

Campbell, CA, United States of America

James A Hunter