Trw Limited

Hughes Aircraft Company

James A Hathaway

David Joseph Brunone

Michelle M Reyes

James C Lau

Kenneth Lui

Ronald A DePace

Michael D Runyan

R Thomas Walton

Michael L Turnage

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for example, an aluminum silicon carbide (AlSiC) housing. The component preforms may include resistors, capacitors, and inductors. In addition, RF pins as well as DC pads may be cast in the housing. The electronic components are electrically coupled to an interconnect channel or feedthrough. Interconnections by way of the interconnect channels or feedthroughs within the package may be made by way of metal infusion of a metal, such as aluminum, into the ceramic of the interconnect channels. In an alternate embodiment of the invention, a polymer based integrated package, formed from a polymer, is molded around a cast base which acts as a heat sink. Interconnection between the various electronic components is made by either molding interconnect metal tracings in the polymer housing or by way of interconnection vias which are filled with polymer based conductive paste or immersion plating. In both embodiments, interconnections between electronic components forming the electronic circuit are made without the use of glass feedthroughs which greatly simplifies the cost and complexity of the package.

Method of producing an advanced RF electronic package

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for example, an aluminum silicon carbide (AlSiC) housing. The component preforms may include resistors, capacitors, and inductors. In addition, RF pins as well as DC pads may be cast in the housing. The electronic components are electrically coupled to an interconnect channel or feedthrough. Interconnections by way of the interconnect channels or feedthroughs within the package may be made by way of metal infusion of a metal, such as alumninum, into the ceramic of the interconnect channels. In an alternate embodiment of the invention, a polymer based integrated package, formed from a polymer, is molded around a cast base which acts as a heat sink. Interconnection between the various electronic components is made by either molding interconnect metal tracings in the polymer housing or by way of interconnection vias which are filled with polymer based conductive paste or immersion plating. In both embodiments, interconnections between electronic components forming the electronic circuit are made without the use of glass feedthroughs which greatly simplifies the cost and complexity of the package.

Advanced RF electronics package

An apparatus for mounting a waveguide window or conduction member into a housing such that a smooth gradient of the coefficient of thermal expansion exists between the housing and the window or conduction member, thereby reducing the internal stress which results from ambient temperature variations. The apparatus comprises a frame member for mounting a feedthrough member into a housing. The frame member includes a buffer section having a plurality of sections, each section having a material which progressively varies the coefficient of thermal expansion. The frame member further includes additional stress relief features and structural elements facilitating manufacture and assembly of the apparatus.

Low stress waveguide window/feedthrough assembly

A carrier for an integrated circuit package is disclosed which comprises a base (30) suitable for receiving an integrated circuit package with unformed leads (20') or formed leads (20), a cover (60), flexible material (66), such as an elastomer, disposed between the cover (60) and base (30) surfaces, and pressure is maintained across the cover (60) and base (30) by way of finger (44) on a clip (40) on the base (30) engaging latching edges (68) of cover (60). The leads (22) of the integrated circuit package (20, 20') are thereby secured in position by the elastomeric material (66) which forms itself partially around each of the leads in response to pressure applied across the base (30) and cover (60) as hereinabove described. The disclosed invention eliminates the need for separate grooves or nests in the base (30) of the carrier for each lead of the integrated circuit package.

Growing community of inventors

Redondo Beach, CA, United States of America

James A Hathaway